采用等离子表面合金化技术, 对TC4钛合金表面进行渗铜、镍处理, 运用X射线衍射仪、扫描电子显微镜、辉光放电光谱仪等分析了铜镍改性层的形貌、物相及其成分; 利用平板培养法检测改性前后钛合金的抗菌性能, 并初步分析其抗菌机理。结果表明: 经合金化处理后, TC4合金表面形成一层与基体结合良好、厚度约7.5 μm的铜镍改性层; 涂层表面镍质量分数为40%左右, 铜质量分数为8%左右, 并沿深度方向呈梯度下降; 处理后的TC4合金对大肠杆菌的抗菌效果明显, 表现出优良的抗菌性能; 其抗菌机理主要与铜的作用有关。

Copper and nickel were permeated into the surface of TC4 alloy by plasma alloying technology. Using XRD, SEM and GDS, the morphology, composition and phase of the layer were analyzed. The antibacterial properties of the TC4 alloy before and after alloying were tested through plating method, and antibacterial mechanism was preliminary analyzed. Results show that an alloy layer bonding well with matrix with thickness about 7.5 μm formed on the surface of TC4 alloy after alloying treatment. The alloy layer contained about 40 wt.% of Ni and 8 wt.% of Cu, and the contents of Cu and Ni displayed a gradient descent along it′s depth. The antibacterial effect of the alloy layer to escherichia coli was obvious, so the treated TC4 show a good antibacterial property. The antibacterial mechanism was related to Cu.