微量钕对Sn-6.5Zn/铜焊点界面组织与性能的影响
Influence of Trace Amounts of Nd on Microstructure and Performance of Sn-6.5Zn/Cu Joints
摘 要
采用SEM、EDS和拉伸-剪切试验等方法研究了微量稀土元素钕对Sn-6.5Zn-xNd(x=0, 0.1, 0.5)钎料/铜焊点界面组织, 重点是界面金属间化合物(IMC)特征及结合性能的影响。结果表明: 在Sn-6.5Zn合金中添加微量钕具有明显的变质作用, 能够促进界面形成均匀细密的Cu5Zn8 IMC层; 钕添加量的增加对界面IMC尺寸与分布没有产生明显影响; 钕添加量为0.1% (质量分数, 下同)时能显著改善钎料/铜焊点结合性能, 而当添加量为0.5%时, 界面处稀土化合物的聚集会导致焊点结合性能下降。
Sn-6.5Zn钎料
界面
结合性能
Nd
Sn-6.5Zn solder
interface
binding ability
Abstract
The influences of trace amounts of Nd on the microstructure of Sn-6.5Zn-xNd (x=0, 0.1, 0.5), especially on the characteristics of intermetallic compound (IMC) and the bonding performance, were investigated using SEM,EDS and tensile-shearing testing. The results indicate that the modification effect was obvious when a trace amount of Nd was added into the Sn-6.5Zn alloy, which can be attributed to the formation of a fine and uniform IMC layer at the interface. The increment of Nd addition had no obvious effect on the size and distribution of IMC at the interface. With the addition of 0.1wt.% Nd, the bonding performance of the soldered joint improved markedly, but the binding ability of the soldered joint reduced because of the segregation of the Nd-rich phases in the interface when 0.5wt% Nd was added in Sn-6.5Zn alloy.
中图分类号 TG454
所属栏目 纳米材料
基金项目 重庆市教委科研项目(KJ132105); 重庆工业职业技术学院科研项目(GZY201210-YK)
收稿日期 2012/12/27
修改稿日期 2013/12/5
网络出版日期
作者单位点击查看
备注赵国际(1971-), 男, 河南焦作人, 副教授, 博士。
引用该论文: ZHAO Guo-ji. Influence of Trace Amounts of Nd on Microstructure and Performance of Sn-6.5Zn/Cu Joints[J]. Materials for mechancial engineering, 2014, 38(3): 31～34
赵国际. 微量钕对Sn-6.5Zn/铜焊点界面组织与性能的影响[J]. 机械工程材料, 2014, 38(3): 31～34
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