采用典型的氰化电镀与无氰刷镀工艺在隔离开关触头的基材表面成功制备了银镀层，比较了两种工艺条件下触头镀银层表面形貌、显微硬度、厚度均匀性、结合力及在3.5%氯化钠溶液中耐蚀性等性能的差异。结果表明，无氰刷镀银层的显微硬度达130 HV，与氰化电镀银层相当，满足DL/T 486－2010硬度要求;经刻划栅格试验镀层未剥落，基体结合力接近或达到氰化电镀银层水平。但无氰刷镀银层存在漏镀孔洞，致使该镀层在3.5%氯化钠溶液中腐蚀速率达59.6 μm/a，相同腐蚀介质中的氰化电镀银层仅为1.5 μm/a，且无氰刷镀银层的厚度均匀性不够稳定。

Ag coatings were prepared on the surface of switch contact by typical cyanide plating and non-cyanide brush-plating. The performance of Ag coatings prepared by the two processes, including surface morphology, micro-hardness, thickness uniformity, adhesion between Ag coating and matrix and corrosion resistance in 3.5% sodium chloride solution, were tested and compared. The results showed that the micro-hardness of Ag coating by non-cyanide plating was up to 130 HV, equivalent to that of the cyanide plated silver layer, and could meet the hardness requirements in the DL/T 486-2010 standard. Spalling was not found for non-cyanide Ag coating after grid testing, indicating that the adhesion between non-cyanide Ag coating and matrix approached or reached the level of cyanide plated Ag coating. But Ag coating by non-cyanide brush plating had some pores, resulting in a corrosion rate of 59.6 μm/a in 3.5% NaCl solution. Corrosion rate of Ag coating by cyanide plating was only 1.5 μm/a in the same corrosion system. In addition, the thickness uniformity of non-cyanide plating layer was not stable.