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铜表面聚合物刷的制备及其电化学性能
          
Preparation and Electrochemical Performance of Polymer Brush on Copper Substrate

摘    要
采用N-[亚苄基-1, 2-乙二氨基乙基]-2-溴异丁酰胺为引发剂, 联吡啶为配体, 溴化亚铜为催化剂, 实现了铜表面引发甲基丙烯酸甲酯原子转移自由基聚合, 在铜表面形成一层聚甲基丙烯酸甲酯(PMMA)聚合物刷, 在0.5 mol/L NaCl介质中, 采用极化曲线和电化学阻抗法, 考察了聚合物刷的电化学性能。结果表明, 铜表面接枝的PMMA分子量达到1.27×105时, 腐蚀电位提高到22 mV, 腐蚀电流密度降低到0.88 μA/cm2, 缓蚀效率达到96.61%, 膜的电容值为0.398×10-7 F/cm2, 在0.5 mol/L NaCl溶液中浸泡24 h后, NaCl水溶液渗透进入PMMA薄膜的百分比为77.06%。
标    签   表面引发原子转移自由基聚合   聚合物刷   电化学性能   copper   surface-initiated atom transfer radical polymerization   polymer brush   electrochemical performance  
 
Abstract
Poly(methylmethacrylate) (PMMA) brushes were grafted from copper substrate by surface-initiated atom transfer radical polymerization from a surface-bound N-[salicylidene-1, 2-ethanediaminoethyl]-2-Bromoisobutyramide (SEB) initiator, with CuBr as catalyst and 2, 2′-bipyridine as ligand. The electrochemical performance of PMMA brush was evaluated by electrochemical impedance spectroscopy (EIS)and polarization curves in 0.5 mol/L NaCl solution. The results showed that when molecular weight of PMMA brush on copper surface reached 1.27×105, the corrosion potential was 22 mV, and the corrosion current density was 0.88 μA/cm2, the capacitance was 0.398×10-7 F/cm2 and the inhibition efficiency was 96.61%, after soaked in 0.5 mol/L NaCl solution for 24 h, 77.06% NaCl solution permeated into the film of PMMA brush.

中图分类号 TG174.42

 
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收稿日期 2010/4/16

修改稿日期 2010/5/13

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引用该论文: LU Gang,LU Chun-hua,XU Zhong-zi,LI Yi-min. Preparation and Electrochemical Performance of Polymer Brush on Copper Substrate[J]. Corrosion & Protection, 2011, 32(4): 285


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参考文献
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