焦磷酸盐电镀Cu-Sn合金是替代氰化物镀Cu-Sn合金的最重要电镀工艺, 但是它的最大缺点是电沉积速度慢、镀层耐腐蚀性差。本工作采用电化学方法和失重腐蚀试验, 研究了添加剂对焦磷酸盐电镀Cu-Sn合金的电沉积速度、失重腐蚀速度、腐蚀电流密度等的影响。结果表明, 焦磷酸盐电镀Cu-Sn合金的最佳添加剂是光亮剂乙二胺(EDA, 0.5 g/L)、辅助光亮剂甲醛(HCHO, 0.5 g/L)与表面张力处理剂 (SDBS, 0.5 g/L)三者的复合。

Electroplating of Cu-Sn alloy coating in pyrophosphate bath is the most important electroplating process which can substitute Cu-Sn cyanide electroplating, but the biggest shortcoming of it is slow deposition rate and poor anti-corrosion properties of Cu-Sn alloy coating. The influence of additives on the properties of Cu-Sn coating was studied by electrochemical and weight-loss methods. The results showed that the optimal additives of pyrophosphate Cu-Sn electroplating are 0.5 g/L ethylenediamine (brightener), 0.5 g/L HCHO (auxiliary brightener) and 0.5 g/L SDBS (surfactant).