Corrosion Resistance of Cu-15Ni-8Sn Alloy in Seawater
摘 要
在灭菌海水中对铜镍锡合金Cu-15Ni-8Sn进行耐腐蚀性试验。采用金相组织观察、电化学阻抗谱检测(EIS)、扫描电子显微镜(SEM)和能谱仪(EDS)分析等测试技术, 研究了该合金在海水中的腐蚀行为。结果表明, 该合金在浸入海水初期会经过一个复杂的钝化过程, 形成层次分明的不同腐蚀产物, 然后进入一个长期稳定期, 其中内层致密的镍和锡的钝化层对合金优良的耐腐蚀性起关键作用。
Abstract
The corrosion behavior of a copper-nickel-tin alloy exposed to artificial seawater was investigated by metallographic microstructure observation, electrochemical impedance spectroscopy uscopy (EIS) tests, scanning electron microscopy and energy dispersive spectrometer analysis. The results showed that there was a complex passivation process after the Cu-15Ni-8Sn alloy immersed in seawater, layered corrosion products formed on the surface, and then the corrosion resistance became long-term stabile. An internal compact passivation layer of nickel and tin improved the corrosion resistance of this alloy significantly.
中图分类号 TG172.5
所属栏目 试验研究
基金项目 国家自然科学基金(51003056, 51042013, 51101098); 上海市科委创新项目(10170502400)
收稿日期 2011/11/2
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备注尹衍升, 教授, 博士生导师,
引用该论文: YIN Bing,LIU Tao,DONG Li-hua,ZHANG Li,YIN Yan-sheng. Corrosion Resistance of Cu-15Ni-8Sn Alloy in Seawater[J]. Corrosion & Protection, 2012, 33(10): 849
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参考文献
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【2】祁红璋, 安建军, 严彪. Cu-15Ni-8Sn 合金的开发与应用现状[J]. 金属功能材料, 2009, 16(4):57-60.
【3】Raymond Cribb W, John O Ratka. Copper spinodal alloys[J]. Advanced Material & Processes, 2002:27-30.
【4】Miloev I, Metiko-Hukovic M. The behaviour of Cu-xNi(x=10 to 40%) alloys in alkaline solutions containing chloride ions[J]. Electrochimica Acta, 1997, 42(10):1537-1548.
【5】Sequeira C A C. Inorganic, physicochemical, and microbial aspects of copper corrosion:literature survey[J]. British Corrosion Journal, 1995, 30(2):137-153.
【6】Barbucci A, Fame G, Matteazzi P, et al. Corrosion behaviour of nanocrystalline Cu90Ni alloy in neutral solution containing chlorides[J]. Corrosion Science, 1998, 41(3):463-475.
【7】Debiemme-Chouvy C, Ammeloot F, Sutter E M M. X-ray photoemission investigation of the corrosion film formed on a polished Cu-13Sn alloy in aerated NaCl solution[J]. Applied Surface Science, 2001, 174(1):55-61.
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