铜铬合金搅拌摩擦焊焊接接头的组织与性能
Microstructure and Properties of Friction Stir Welding Welded Joints for Cu-Cr Alloy
摘 要
采用硬度和电导率测试、光学显微镜和扫描电镜观察等方法研究了固溶态和时效态下铜铬合金的搅拌摩擦焊焊接接头的组织与性能。结果表明:铜铬合金搅拌摩擦焊接接头不同区域的显微组织有明显的差异; 固溶态合金接头硬度最高值出现在焊核区, 为78 HB, 距离焊缝中心越远硬度越低, 电导率越小; 时效态合金接头硬度最低值出现在热影响区, 为91 HB, 电导率由基体到焊核区逐渐减小。
搅拌摩擦焊
焊接接头
显微组织
Cu-Cr alloy
friction stir welding
welded joint
microstructure
Abstract
The solid-solution treated and aged Cu-Cr alloy were welded by friction stir welding respectively, and the microstructure and mechanical properties of welded joints were studied by hard test, electrical conductivity test, optical microscopy and scanning electron microscopy. The results show that the difference of microstructure between different zones in welded joint of friction stir welding for Cu-Cr alloy was distinct. The hardness value of weld nugget zone, 78 HB, in the joint of solid-solution treated alloy was highest, the farther to the welded seam center, the lower of the hardness and the electrical conductivity. The hardness value of HAZ, 91 HB, in the joint of aged alloy was lowest, and the electrical conductivity dropped gradually from matrix to welded nugget zone.
中图分类号 TG457.13
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基金项目
收稿日期 2010/9/5
修改稿日期 2011/6/16
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备注谢虎(1986-),男,江苏东台人,硕士研究生。
引用该论文: XIE Hu,SONG Lian-peng,GONG Xi,HE Di-qiu. Microstructure and Properties of Friction Stir Welding Welded Joints for Cu-Cr Alloy[J]. Materials for mechancial engineering, 2011, 35(10): 88～90
谢虎,宋练鹏,龚习,贺地求. 铜铬合金搅拌摩擦焊焊接接头的组织与性能[J]. 机械工程材料, 2011, 35(10): 88～90
被引情况:
【1】何力佳,王 函,张泽洲,赵晓杰, "焊前预热对T2紫铜激光焊接接头组织和性能的影响",机械工程材料 40, 49-52(2016)
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参考文献
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【2】DAWES C J, THOMAS W M. Friction stir process welds aluminium alloys[J]. Weld J,1996,75(3):41-45.
【3】THOMES W M, NICHOLAS E D. Friction stir welding for the transportation industries [J]. Materials & Design,1997,18(4/6):269-273.
【4】SHINODA T. Recent development of friction stir welding-new solid state joining technology[J]. Int J Mater Product Technol,2001(2):453-457.
【5】辜纯民, 邓卫华, 杨成刚, 等.搅拌摩擦焊工艺参数对LY12铝合金接头组织和力学性能的影响[J].机械工程材料, 2008, 32(6): 22-24.
【6】马凤仓,倪锋,杨涤心.铜铬合金制备方法研究现状[J].材料开发与应用,2003,17(3): 35-38.
【7】宋练鹏,尹志民,李周.Cu-Cr合金时效处理工艺及其强化机制的定量探讨[J].矿冶工程,2005,25(1): 61-64.
【8】刘会杰,匡玲艺,沈俊军,等.铜的搅拌摩擦焊研究[J].焊接学报,2009(1): 11-15.
【9】刘平,曹国兴.快速凝固高强度高导电Cu-Cr合金的组织和性能[J].兵器材料科学与工程,1999(1):12-16.
【10】帅歌旺,张萌,黄惠珍.Cu-Cr合金强化机制研究及其对导电性能的影响[J].铸造技术,2007(3):396-398.
【11】方俊鑫, 陈栋. 固体物理[M]. 北京: 高等教育出版社,1981.
【12】郑子樵.材料科学基础[M].长沙:中南大学出版社, 2006.
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