电沉积制备铜-锡-PTFE自润滑复合镀层工艺参数对其性能的影响
Effect of Process Parameters during Preparating Cu-Sn-PTFE Self-Lubricant Composite Coating by Electrodeposition Method on Its Properties
摘 要
用复合电沉积法在不锈钢基体上制备铜-锡-PTFE自润滑复合镀层, 并用扫描电子显微镜、能谱仪、摩擦磨损试验机等研究了十六烷基三甲基溴化胺(CTAB)及PTFE的加入量、电流密度、沉积温度等工艺参数对复合镀层组成和性能的影响。结果表明: 镀层中PTFE的含量随镀液中CTAB及PTFE加入量增加而增大, 当加入量分别达到0.3 g·L-1和36 g·L-1时PTEE的含量最大; 随电流密度的增大, 镀层中PTFE含量增加, 超过3 A·dm-2 后其含量下降; 适宜的沉积温度为50~55 ℃; 复合镀层显微硬度随镀层中PTFE 含量增加而降低, 当镀液中PTFE质量浓度为36 g·L-1时镀层摩擦因数最低, 为0.09。
Cu-Sn-PTFE复合镀层
自润滑
电流密度
electrodeposition
Cu-Sn-PTFE composite coating
self-lubricant
current density
Abstract
The self-lubricant composite coating of Cu-Sn-PTFE was prepared on stainless steel substrate by electrodeposition method. The effects of process parameters of CTAB and PTFE content, current density and deposition temperature on composition and properties of composite coating were studied by scanning electron microscopy, energy disperse spectroscopy and abrasion testing machine. The results show that PTFE content in composite coating increased with increase of CTAB and PTFE in plating bath, and its content was maximum when CTAB and PTEE reached 0.3 g·L-1 and 36 g·L-1 respectively. PTFE content increased with increase of current density and then decreased after current density was over 3 A·dm-2. The microhardness of the composition coating decreased with increase of PTFE content in composite coating. The lowest friction coefficient of coating was 0.09 when the mass concentration of PTFE in plating bath was 36 g·L-1.
中图分类号 TQ153.4
所属栏目
基金项目 上海市科委资助项目(09dz1203000)
收稿日期 2010/11/1
修改稿日期 2011/8/3
网络出版日期
作者单位点击查看
备注黄志荣(1953-), 男, 上海人, 副教授, 博士。
引用该论文: HUANG Zhi-rong,LI Pan-yu. Effect of Process Parameters during Preparating Cu-Sn-PTFE Self-Lubricant Composite Coating by Electrodeposition Method on Its Properties[J]. Materials for mechancial engineering, 2011, 35(11): 78～81
黄志荣,李攀瑜. 电沉积制备铜-锡-PTFE自润滑复合镀层工艺参数对其性能的影响[J]. 机械工程材料, 2011, 35(11): 78～81
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【13】WAN Y Z, WANG Y L, TAO H M. Preparation and characterization of different particles-copper electrocomposites[J].Journal of Materials Science letters,1998,17(14):1251-1253.
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