铜铋合金与ZrO2陶瓷扩散焊接头的组织与剪切强度
Microstructure and Shear Strength of Diffusion Bonding Joint between Cu-Bi Alloy and ZrO2 Ceramic
摘 要
在1.3 Pa的真空环境下, 用扩散焊接法进行了Cu-x%Bi合金(x=0, 0.5, 1.0, 2.0)与ZrO2陶瓷的连接, 并采用扫描电镜、电子探针及剪切试验机等研究了铜铋合金与ZrO2陶瓷扩散焊接头的组织及剪切强度。结果表明: 在焊接压力作用下挤入接合界面的铋, 在焊接后部分残留在界面上, 对焊接热应力有缓释作用, 可提高接头的剪切强度; 当接头的使用温度高于373 K后, 由于界面上铋的软化, 接头的剪切强度急剧下降, 难以在高温环境中使用。
铜铋合金
ZrO2陶瓷
剪切强度
diffusion welding
Cu-Bi alloy
ZrO2 ceramic
shear strength
Abstract
Diffusion bonding between Cu-x%Bi (x=0, 0.5, 1.0, 2.0) alloy and ZrO2 ceramic was carried out under the vacuum condition of 1.3 Pa. The microstructure and shear strength of joint between Cu-Bi alloy and ZrO2 was studied by scanning electron microscopy, electron probe (EPMA) and shear tester. The results show that the Bi elements were squeezed into bonding interface by welding pressure and partial Bi remained on the interface after welding could relax the thermal stress and increase the shear strength of the joint. However, the shear strength of the joint decreased sharply because Bi element on the interface would softened after the using temperature was more than 373 K, so it was difficult that the joint was used in high-temperature environment.
中图分类号 TG457
所属栏目 试验研究
基金项目
收稿日期 2011/3/12
修改稿日期 2011/12/7
网络出版日期
作者单位点击查看
备注潘厚宏(1964-), 男, 重庆人, 副教授, 博士。
引用该论文: PAN Hou-hong,LIU Yong-jun,ZHANG Da-xiang,ITOH Isao. Microstructure and Shear Strength of Diffusion Bonding Joint between Cu-Bi Alloy and ZrO2 Ceramic[J]. Materials for mechancial engineering, 2012, 36(3): 11～13
潘厚宏,刘拥军,张大向,伊藤勲. 铜铋合金与ZrO2陶瓷扩散焊接头的组织与剪切强度[J]. 机械工程材料, 2012, 36(3): 11～13
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参考文献
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【2】ITOH I, OTOGURA Y, DOI T,et al. Diffusion welding of zirconia and Al-Sn alloy in the atmosphere[J]. Journal of Japan Institute of Light Metals,1993,43(3):134-138.
【3】ITOH I, OTOGURA Y, DOI T,et al. Diffusion welding of Si3N4 and Al-Sn alloy in the atmosphere[J]. Journal of Japan Institute of Light Metals,1993,43(5):258-262.
【4】PAN H H, ITOH I, MATSUBAR M. Mechanical properties of diffusion bonding joint of SiC and Al-Sn alloys at elevated temperatures[J]. Materials Transactions,2001,42(12):2543-2547.
【5】ITOH I, OTOGURA Y, KOUZUMA K,et al. Diffusion welding of Al-Sn alloy and steel in the atmosphere[J]. Journal of Japan Institute of Light Metals,1993,43(8):433-437.
【6】YAMADA H, ITOH I, NAKATA H,et al. Diffusion bonding of Al-Sn alloys and Mo in the atmosphere[J]. Journal of Japan Institute of Light Metals,1997,47(5):279-284.
【7】ITOH I, OTOGURA Y, HASEGAWA K. Diffusion welding of Al-Sn alloy and copper[J]. Journal of Japan Institute of Light Metals,1991,41(9):590-595.
【8】ITOH I, OTOGURA Y, KOUZUMA K,et al. Diffusion bonding of Al-Sn alloy to Cu or 7-3 brass in the atmosphere[J]. Journal of the Japan Copper and Brass Research Association,1994,33(1):82-87.
【9】ITOH I, YAMADA H, OTOGURA Y. Diffusion bonding of Cu-Sn alloy and Al-Sn alloys in the atmosphere[J]. Journal of the Japan Copper and Brass Research Association,1996,35(1):126-131.
【10】戴永年. 二元合金相图集[M]. 北京:科学出版社,2009.
【11】HONIG R E. Vapor pressure data for the solid and liquid elements[J]. Rca Review,1962,11:567-579.
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