采用超声-脉冲电铸工艺在覆铜板表面的微区域内制备了镍铸层,用扫描电镜观察镍铸层的表面形貌, 并采用Image Tool软件测量了镍铸层的平均晶粒尺寸, 研究了超声波功率及方向、脉冲平均电流密度、脉冲占空比等对镍铸层晶粒尺寸的影响。结果表明: 其他条件相同时, 双向(y向和z向)超声波制备镍铸层的晶粒尺寸小于相同功率单向(y向或z向)超声制备的; 随着超声波功率、脉冲平均电流密度的增大, 镍铸层的晶粒尺寸先减小后增大; 当脉冲占空比由10%增大到30%时, 晶粒尺寸由0.97 μm增大到3.32 μm。

The nickel electroforming layer was prepared by ultrasonic-pulse electroforming process in the micro-region on employed copper clad laminate (CCL) surface. The surface morphology of nickel electroforming layer was observed by scanning electron microscopy and the average grain size was measured by Image Tool software, and the effects of ultrasonic power and direction, pulse average current density and pulse duty ratio on the grains size of nickel electroforming layer were studied. The results show that when other conditions were remained unchanged, the grain size of nickel electroforming layer prepared under double-direction ultrasonic (y direction and z direction) was less than that under single-direction ultrasonic(y direction or z direction). And the grain size of nickel eletroforming layer decreased first and then increased with the increase of ultrasonic power and the pulse average current density. The grain size of nickel electroforming layer increased from 0.97 μm to 3.32 μm when the pulse duty ratio increased from 10% to 30%.