Effect of Al Addition on Glass Forming Ability of Cu55Hf45 Binary Alloy
摘 要
在具有高玻璃形成能力(GFA)的铜铪二元合金基础上, 研究了铝元素添加对Cu55Hf45二元合金凝固组织及GFA的影响。结果表明: 添加7%的铝(原子分数)可显著提高Cu55Hf45合金的GFA, 其玻璃形成临界直径由1.5 mm提高到8 mm; Cu53Hf40Al7合金具有最佳GFA, 其压缩应变达到2.1%~3.9%, 屈服强度可达2 210~2 470 MPa。
Abstract
The effects of Al addition on the solidification structure and glass-forming ability (GFA) of Cu55Hf45 alloy were investigated based on the Cu-Hf binary alloy with high GFA. The results show that 7 at.% Al addition can improve the GFA of Cu55Hf45 alloy greatly whose critical diameter was increased from 1.5 to 8 mm. Cu53Hf40Al7 alloy had the best GFA, compressive strain up to 2.1%-3.9% and yield strength in a range of 2 210-2 470 MPa.
中图分类号 TG139.8
所属栏目 试验研究
基金项目
收稿日期 2012/3/31
修改稿日期 2012/12/28
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备注贾焕丽(1980-), 女, 山东泰安人, 讲师, 硕士。
引用该论文: JIA Huan-li,LIU Jian-hua. Effect of Al Addition on Glass Forming Ability of Cu55Hf45 Binary Alloy[J]. Materials for mechancial engineering, 2013, 37(6): 31~34
贾焕丽,刘建华. 铝元素添加对Cu55Hf45二元合金玻璃形成能力的影响[J]. 机械工程材料, 2013, 37(6): 31~34
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参考文献
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【2】XU D H. LOHWONGWATANA B, DUAN, G, et al. Bulk metallic glass formation in binary Cu-rich Alloy series Cu100-x-Zrx (x=34, 36, 38.2, 40 at.%) and mechanical properties of bulk Cu64Zr36 glass[J].Acta Mater, 2004, 52: 2621-2624.
【3】WANG D, LI Y, SUN B B, et al. Bulk metallic glass formation in the binary Cu-Zr system[J].Appl Phys Lett, 2004, 84: 4029-4031.
【4】INOUE A, ZHANG W. Formation, thermal stability and mechanical properties of Cu-Zr and Cu-Hf binary glassy alloy rods[J].Mater Trans JIM, 2004, 45: 584-587.
【5】DUAN G, XU D H, JOHNSON W L. High copper content bulk glass formation in bimetallic Cu-Hf system. Metall[J].Mater Trans A, 2005, 36: 455-458.
【6】INOUE A, ZHANG W. Formation and mechanical properties of Cu-Hf-Al bulk glassy alloys with a large supercooled liquid region of over 90 K[J].J Mater Res, 2003, 18: 1435-1440.
【7】TAN H, ZHANG Y, MA D, et al. Optimum glass formation at off-eutectic composition and its relation to skewed eutectic coupled zone in the La based La-Al-(Cu, Ni) pseudo ternary system[J].Acta Mater, 2003, 51: 4551-4561.
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