以硅基底上生长的薄膜样品为例, 详细介绍了一种新的制备透射电镜截面样品的方法和步骤, 即先层叠矩形薄片成块状, 然后用低速锯切割得到层叠截面薄片, 再将截面薄片和一厚度相当的硅片同时粘贴在有机玻璃样品柱上, 然后对样品进行研磨抛光, 通过观察硅片的透光颜色确定样品的厚度, 最后将样品从样品柱上取下, 粘贴上铜片, 切成圆片状, 进行离子减薄, 完成样品的制备。该方法通过手动研磨直接将截面样品预减薄到可以用离子减薄仪减薄的程度, 在简化了制样过程的同时, 还可以获得具有更多薄区的透射电镜截面样品。

A new method for preparing cross-sectional TEM specimens was introduced in detail taking a film growing on silicon substrate as an example. First stacking the rectangular slices into block, and then cutting the stacking block with low speed diamond wheel to get thin stacked sheet. Secondly pasting the thin stacked sheet and a silicon slice on an organic glass specimen column at the same time. Thirdly grinding and polishing the specimen, and confirming the thickness of the specimen by observing the color of the silicon slice. Finally taking down the specimen, pasting a brass ring on it, cutting it into a disc and ion milling to complete the specimen preparation. The produced new cross-sectional TEM specimens preparation method could thin down the specimens only by manual grinding to get the thickness which could be ion milling directly. Therefore, this preparation method could not only simplify the preparing process, but also get larger area for TEM observation.