真空压力浸渗法制备金刚石/铝复合材料及其热性能
Fabrication and Thermal Properties of Diamond/Al Composites Prepared by Vacuum Pressure Infiltration Method
摘 要
采用真空压力浸渗法制备了金刚石/铝复合材料, 研究了金刚石颗粒尺寸、品级等对复合材料热性能的影响。结果表明: 在金刚石体积分数相同情况下, 普通研磨级金刚石颗粒的尺寸越小, 复合材料的热膨胀系数越低;用MBD4等级金刚石颗粒制备的金刚石/铝复合材料具有最小的热膨胀系数, 为6.8×10-6K-1, 其热导率最高;MBD4等级的金刚石颗粒与铝基体存在选择性粘附现象, 金刚石的(100)面更容易与铝结合。
真空压力浸渗
热膨胀系数
热导率
界面结合
diamond/Al composite
vacuum pressure infiltration
thermal expansion coefficient
thermal conductivity
interface bonding
Abstract
Diamond/Al composites were fabricated by vacuum pressure infiltration method. The thermal properties of the composites with different particle sizes and grades were investigated. The results show that the thermal expansion coefficient of the composite decreased with the decrease of particle size of common grinded diamond when the volumn fraction of diamond did not change. The thermal expansion coefficient of the composite made of MBD4 grade diamonds was 6.8×10-6K-1, which was the lowest among all the composites, and the thermal conductivity of the composite was the highest. The phenomenon of selective adhesion between MBD4 grand diamond and aluminum matrix was observed, and (100) face of the diamond was inclined to combine with the pure aluminum.
中图分类号 TB333
所属栏目 试验研究
基金项目 国家重点基础研究发展计划项目(2012CB619600);国家高技术研究发展计划项目(2013AA031201)
收稿日期 2013/8/16
修改稿日期 2014/7/2
网络出版日期
作者单位点击查看
备注裴和君(1989-)，男，江苏宜兴人，硕士研究生。
引用该论文: PEI He-jun,OUYANG Qiu-bao,ZHANG Di,YU Hong,LIU Yun-meng. Fabrication and Thermal Properties of Diamond/Al Composites Prepared by Vacuum Pressure Infiltration Method[J]. Materials for mechancial engineering, 2014, 38(12): 6～9
裴和君,欧阳求保,张荻,虞红. 真空压力浸渗法制备金刚石/铝复合材料及其热性能[J]. 机械工程材料, 2014, 38(12): 6～9
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参考文献
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【2】YAMAMOTO Y, IMAI T, TANABE K, et al. The measurement of thermal properties of diamond［J］.Diamond and Related Materials,1997,6(8):1057-1061.
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【4】TONG Zhen-song, SHEN Zhuo-shen, ZHANG Yu-juan. Aluminum/diamond composites and their applications in electronic packaging［C］//Electronic Packaging Technology,2007.［S.l.］:IEEE,2007:1-7.
【5】BEFFORT O, VAUCHER S, KHALID F A. On the thermal and chemical stability of diamond during processing of Al/diamond composites by liquid metal infiltration (squeeze casting)［J］.Diamond and Related Materials,2004,13(10):1834-1843.
【6】KHALID F A, BEFFORT O, KLOTZ U E, et al. Microstructure and interfacial characteristics of aluminium-diamond composite materials［J］.Diamond and Related Materials,2004,13(3):393-400.
【7】SCHBEL M, DEGISCHER H P, VAUCHER S, et al. Reinforcement architectures and thermal fatigue in diamond particle-reinforced aluminum［J］.Acta Materialia,2010,58(19):6421-6430.
【8】熊德赣,刘希从,鲍小恒,等.AlSiC 电子封装基片的制备与性能［J］.中国有色金属学报,2006,16(11):1913-1917.
【9】KLEINER S, KHALID F A, RUCH P W, et al. Effect of diamond crystallographic orientation on dissolution and carbide formation in contact with liquid aluminium［J］.Scripta Materialia,2006,55(4):291-294.
【10】MONJE I E, LOUIS E, MOLINA J M. Aluminum/diamond composites: a preparative method to characterize reactivity and selectivity at the interface［J］.Scripta Materialia, 2012, 66(10): 789-792.
【11】LU W C, ZHANG R Q. Simulation of diamond metallization using aluminum［J］.Diamond and Related Materials,2003,12(9):1553-1558.
【12】COLLINS K C, CHEN S, CHEN G. Effects of surface chemistry on thermal conductance at aluminum-diamond interfaces［J］.Applied Physics Letters,2010,97(8):083102-1-083102-3.
【13】TAN Z, LI Z, FAN G, et al. Enhanced thermal conductivity in diamond/aluminum composites with a tungsten interface nanolayer［J］.Materials & Design, 2013, 47: 160-166.
【14】LIANG X, JIA C, CHU K, et al. Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings［J］.Rare Metals,2011,30(5):544-549.
【15】欧阳求保,崔光华,张荻,等.深冷处理对 SiCp增强铝基复合材料热膨胀性能的影响［J］.机械工程材料,2010,34(2):18-20.
【16】CUI Y, XU S B, ZHANG L, et al. Microstructure and thermal properties of diamond-Al composite fabricated by pressureless metal infiltration［J］.Advanced Materials Research,2011,150:1110-1118.
【17】RUCH P W, BEFFORT O, KLEINER S, et al. Selective interfacial bonding in Al (Si)-diamond composites and its effect on thermal conductivity［J］.Composites Science and Technology, 2006, 66(15): 2677-2685.
【18】王新宇,于家康,朱晓敏.镀 TiC 金刚石/铝复合材料的界面及热膨胀性能［J］.中国有色金属学报,2012,22(6):1718-1724.
【19】CHEN N, PAN X F, GU M Y. Microstructure and physical properties of Al/diamond composite fabricated by pressureless infiltration［J］.Materials Science and Technology,2009,25(3):400-402.
【20】JOHNSON W B, SONUPARLAK B. Diamond/Al metal matrix composites formed by the pressureless metal infiltration process［J］.Journal of Materials Research,1993,8(5):1169-1173.
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