中空玻璃珠/环氧树脂复合材料导热系数的有限元模拟
Modeling of Thermal Conductivity of Hollow-Glass-Bead/Epoxy Resin Composite by Finite Element Method
摘 要
通过有限元模拟方法,用ANSYS软件建立了4种中空玻璃珠随机分布的中空玻璃珠(HGB)/环氧树脂复合材料的数学模型,计算得到了复合材料常温下的导热系数,并与文献中的试验结果进行了对比.结果表明:HGB的热绝缘效果非常显著,随着HGB体积分数增大,HGB/环氧树脂复合材料的导热系数线性减小,模拟结果与文献中的试验结果相符,证明了模拟结果的准确性.
导热系数
有限元法
hollow-glass-bead (HGB)/epoxy resin composite
thermal conductivity
finite element method
Abstract
A mathematic model for four hollow-glass-bead(HGB)/epoxy resin composites with HGB random distribution was set up by finite element method using ANSYS software.The thermal conductivities of the composites at room temperature were calculated, and the predicted results were compared with the test results in some reference.The results show that the thermal insulation effect of HGB was remarkable.With the increase in volume fraction of HGBs,the thermal conductivity of HGB/epoxy resin composites linearly decreased.The predicted results in accordance with the experimental results in the reference were proved to be accurate.
中图分类号 TB332
所属栏目 物理模拟与数值模拟
基金项目 国家科技支撑计划项目(2011BAK06B02)
收稿日期 2013/12/13
修改稿日期 2014/11/5
网络出版日期
作者单位点击查看
备注蒋潇(1992-),男,湖南凤凰人,硕士研究生.
引用该论文: JIANG Xiao,HE Zhu,GAO Biao,CAI Hui,LIU Chun-huan,XU Zhi-an,ZHU Xin-yang. Modeling of Thermal Conductivity of Hollow-Glass-Bead/Epoxy Resin Composite by Finite Element Method[J]. Materials for mechancial engineering, 2015, 39(5): 93～96
蒋潇,贺铸,高标,蔡辉,刘春欢,许志安,祝鑫阳. 中空玻璃珠/环氧树脂复合材料导热系数的有限元模拟[J]. 机械工程材料, 2015, 39(5): 93～96
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参考文献
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【2】TAO Z Q,YANG S Y,GE Z Y,et al.Synthesis and properties of novel fluorinated epoxy resins based on 1,1-bis(4-glycidylesterphenyl)-1-(3'-trifluomethylphenyl)-2,2,2-trifluoroethane[J].Eur Polym J,2007,43(2):550-560.
【3】黎艳,刘伟区,宣宜宁.含氯硅烷/聚硅氧烷改性环氧树脂[J].应用化学,2005,22(2):176-179.
【4】PARK S J,JIN F L,LEE C.Preparation and physical properties of hollow glass microspheres-reinforce epoxy matrix resin[J].Mater Sci Eng:A,2005,402(1):335-340.
【5】PALUMBO M,DONZELLA G,TEMPESTIL E,et al.On the compresstive elasticity of epoxy resins filed with hollow glass microsphere[J].J Appl Polym Sci,1996,60(1):47-53.
【6】FERREIRA J A M,CAPELAB C,COSTA J D.A study of the mechanical behavior on fibre reinforced hollow microspheres hybrid composites[J].Composites:A,2010,41(3):345-352.
【7】D'ALMEIDA J R M.An analysis of the effect of the diameters of glass microspheres on the mechanical behavior of glass-microsphere/epoxy-matrix composites[J].Comp Sci Technol,1999,59(14):2087-2091.
【8】TRES P A.Hollow glass microspheres stronger spheres tackle injection molding[J].Plastic Techno,2007,53(5):82-87.
【9】LIANG J Z.Tensile and impact properties of hollow glass bead-filled PVC composites[J].Maclom Mater Eng,2002,287(9):588-591.
【10】左孔成,蔡振兵,沈明学,等.聚合物基阻尼复合材料的研究现状[J].机械工程材料,2013,37(2):1-5.
【11】BUDOV V V.Hollow glass microsphere use properties and technology[J].Glass Ceram,1994,51(7/8):230-235.
【12】PATANKAR S N,KRANOV Y A.Interface engineering via compatibilization in HDPE composite reinforced with sodium borasilicate hollow glass microspheres[J].Mater Sci Eng:A,2010,527(6):1361-1366.
【13】赵斌,饶保林.Al2O3/环氧树脂复合材料导热性能的研究[J].塑料,2009,38(1):62-64.
【14】TAN J G .FEA by ANSYS6.0[M].Beijing:Beijing University Press,2002.
【15】BAKKER K.Using the finite element method to compute the influence of complex porosity and inclusion structures on the thermal and electrical conductivity[J].J Heat Mass Transfer,1997,40(15):3503-3511.
【16】LIANG J Z,LI F H.Simulation of heat transfer in hollow-glass-bead-filled polypropylene composites by finite element method[J].Polym Test,2007,26 (3):419-424.
【17】ZHU B,MA J,WANG,et al.Thermal,dielectric and compressive properties of hollow glass microsphere filled epoxy-matrix composites[J].J Reinf Plast Comp,2012,31(19):1311-1326.
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