硅基底上喷射电沉积铜/钴多层膜的结合力
Adhesion of Cu/Co Multilayer Film Prepared on Silicon Substrate by Jet Electrodeposition
摘 要
在硅基底上利用喷射电沉积法制备铜/钴多层膜和单层纯铜膜,研究了多层膜的形貌、多层膜和单层铜膜与基体的结合力以及划痕方向对膜基结合力的影响.结果表明:对硅基底进行抛光处理可使膜基结合力减小,粗化处理可在一定程度上提高膜基结合力;多层膜与基底的结合力大于单层铜膜与基底的结合力;当划痕方向平行于工件运动方向时,膜层中的内应力变化不均匀,很容易造成应力累积而使得临界载荷减小,从而使得膜基结合力明显小于划痕方向垂直于工件运动方向时的膜基结合力.
硅
铜/钴多层膜
结合力
jet electrodeposition
silicon
Cu/Co multilayer film
adhesion
Abstract
Cu/Co multilayer film and single-layer copper film on silicon substrate were prepared by jet electrodeposition.The morphology of the multilayer film,the adhesion between multilayer and substrate,the adhesion between single-layer copper film and substrate,and the effects of scratch directions on the adhesion were studied.The results show that polishing the substrate can decrease the adhesion between the film and the substrate,and roughening can improve the adhesion to some extent.The adhesion between multilayer film and substrate is higher than that between single-film and substrate.When the scratch direction is parallel to the direction of the workpiece movement direction,the internal stress is nonuniform,easily to cause the stress accumulation and then make the critical load decreasing,resulting in the adhesion less than the one with scratch direction perpendicular to the workpiece movement direction obviously.
中图分类号 TG662 DOI 10.11973/jxgccl201507007
所属栏目 试验研究
基金项目 国家自然科学基金(青年基金)资助项目(51105204);教育部博士点基金资助项目(20113218120022)
收稿日期 2014/4/8
修改稿日期 2015/3/2
网络出版日期
作者单位点击查看
备注徐诚(1990-),男,江苏丹阳人,硕士研究生.
引用该论文: XU Cheng,SHEN Li-da,TIAN Zong-jun,LIU Zhi-dong,MA Yun,ZHU Jun. Adhesion of Cu/Co Multilayer Film Prepared on Silicon Substrate by Jet Electrodeposition[J]. Materials for mechancial engineering, 2015, 39(7): 35～39
徐诚,沈理达,田宗军,刘志东,马云,朱军. 硅基底上喷射电沉积铜/钴多层膜的结合力[J]. 机械工程材料, 2015, 39(7): 35～39
共有人对该论文发表了看法，其中：
人认为该论文很差
人认为该论文较差
人认为该论文一般
人认为该论文较好
人认为该论文很好
参考文献
【1】鲜晓红,辜敏,李强.Co/Cu纳米多层膜的电化学制备及其微观结构的表征[J].电镀与涂饰,2007,26(5):5-9.
【2】INOMATA K.Giant magneto resistance and its sensor applications[J].Journal of Electroceramics,1998,24:283-293.
【3】钟喜春,曾德长,魏兴钊,等.巨磁电阻材料的研究与应用[J].金属功能材料,2002,9(3):4-7.
【4】易茂中.厚涂层结合强度测定方法研究进展[J].表面技术,1998,27(2):33-37.
【5】LEE M K,WANG J J,WANG H D.Deposition of copper films on silicon from cupric sulfate and hydrofluoric acid[J].J Electrochem Soc,1997,144(5):1777-1780.
【6】ZHAO X H,MIN G H,XU J,et al.Effect of substrate bias-voltage on the structure and mechanical properties of LaB6 films[J].Metallofizikai Noveishie Tekhnologii (Metal Physics and Advanced Technologies),2011,33(3):375-382.
【7】王晓静,邵红红,王季.射频磁控溅射法制备MoS2SiC双层薄膜[J].机械工程材料,2012,36(2):68-75.
【8】李雪飞,谢尚昇,何欢,等.Si(111)和Si(100)衬底上AlN薄膜的激光分子束外延生长特征[J].机械工程材料,2012,36(7):38-59.
【9】田宗军,王桂峰,黄因慧,等.射流电沉积快速成形金属镍制件[J].华南理工大学学报,2010,38(12):41-44.
【10】赵阳培,黄因慧,张君伟,等.脉冲射流电铸纳米晶铜的组织与性能[J].机械工程材料,2006,30(6):87-90.
【11】马胜军.多元阵列喷射电沉积制备铜/镍多层膜及其性能研究[D].南京:南京航空航天大学,2012.
【12】邵红红,王季,王晓静,等.提高钢基表面Al2O3薄膜结合力的研究[J].功能材料,2010,41(5):794-799.
【13】沈艺程,续振林,赵雄超,等.激光表面处理对陶瓷基底化学镀铜层结合力的影响[J].中国表面工程,2006,19(4):28-31.
【14】张广安,吴志国,王明旭,等.Al/AlN多层膜的摩擦磨损性能研究[J].摩擦学学报,2007,27(3):204-209.
【15】HAUERT R,PATSCHEIDER J,KNOBLAUCH L,et al.New coatings by nanostructuring[J].Adv Master,1999,11(2):175-177.
【16】PAUSCHITZ A,KVASNICA S,JISA R,et al. Tribological behavior of Ti containing nanocomposite DLC films under mili-Newton load range[J].Diam Relate Mater,2008,17(12):2010-2018.
【17】LI R L,TU J P,HONG C F,et al.Microstructer mechanical and tribological properties of CrN/W2N multilayer films despositied by DC magnetron sputtering[J].Surface and Coatings Technology,2009,204(4):470-476.
【2】INOMATA K.Giant magneto resistance and its sensor applications[J].Journal of Electroceramics,1998,24:283-293.
【3】钟喜春,曾德长,魏兴钊,等.巨磁电阻材料的研究与应用[J].金属功能材料,2002,9(3):4-7.
【4】易茂中.厚涂层结合强度测定方法研究进展[J].表面技术,1998,27(2):33-37.
【5】LEE M K,WANG J J,WANG H D.Deposition of copper films on silicon from cupric sulfate and hydrofluoric acid[J].J Electrochem Soc,1997,144(5):1777-1780.
【6】ZHAO X H,MIN G H,XU J,et al.Effect of substrate bias-voltage on the structure and mechanical properties of LaB6 films[J].Metallofizikai Noveishie Tekhnologii (Metal Physics and Advanced Technologies),2011,33(3):375-382.
【7】王晓静,邵红红,王季.射频磁控溅射法制备MoS2SiC双层薄膜[J].机械工程材料,2012,36(2):68-75.
【8】李雪飞,谢尚昇,何欢,等.Si(111)和Si(100)衬底上AlN薄膜的激光分子束外延生长特征[J].机械工程材料,2012,36(7):38-59.
【9】田宗军,王桂峰,黄因慧,等.射流电沉积快速成形金属镍制件[J].华南理工大学学报,2010,38(12):41-44.
【10】赵阳培,黄因慧,张君伟,等.脉冲射流电铸纳米晶铜的组织与性能[J].机械工程材料,2006,30(6):87-90.
【11】马胜军.多元阵列喷射电沉积制备铜/镍多层膜及其性能研究[D].南京:南京航空航天大学,2012.
【12】邵红红,王季,王晓静,等.提高钢基表面Al2O3薄膜结合力的研究[J].功能材料,2010,41(5):794-799.
【13】沈艺程,续振林,赵雄超,等.激光表面处理对陶瓷基底化学镀铜层结合力的影响[J].中国表面工程,2006,19(4):28-31.
【14】张广安,吴志国,王明旭,等.Al/AlN多层膜的摩擦磨损性能研究[J].摩擦学学报,2007,27(3):204-209.
【15】HAUERT R,PATSCHEIDER J,KNOBLAUCH L,et al.New coatings by nanostructuring[J].Adv Master,1999,11(2):175-177.
【16】PAUSCHITZ A,KVASNICA S,JISA R,et al. Tribological behavior of Ti containing nanocomposite DLC films under mili-Newton load range[J].Diam Relate Mater,2008,17(12):2010-2018.
【17】LI R L,TU J P,HONG C F,et al.Microstructer mechanical and tribological properties of CrN/W2N multilayer films despositied by DC magnetron sputtering[J].Surface and Coatings Technology,2009,204(4):470-476.
相关信息
