非金属化学镀铜新工艺
A NEW TECHNOLOGY OF NONMETALLIC ELECTROLESS COPPER PLATING
摘 要
在新设计的非金属化学镀铜溶液中,通过考察各个因素对沉积速度和镀液稳定性的影响,确定了新的镀铜工艺.新工艺以次亚磷酸钠代替甲醛作还原剂,以复配的具有催化活性作用的Cu2+和Ni2+作催化剂,镀速快、无毒、铜膜层致密光亮、镀液更稳定,完全优于以甲醛为还原剂的化学镀铜技术.
化学镀
化学镀铜
Nonmetal
Electroless plating
Electroless copper plating
Abstract
A completely new technology of electroless copper plating in the redesigned nonmetallic electroless copper plating solution was developed.The influence of various factors on the depositing speed and stability of the solution was studied.Using hypophosphite as reducing agent replacing formaldehyde and mixed active Cu2+ and Ni2+ as catalyst,the new technology has excellent performonce such as high speed,no toxin,compact and lucent plating,steady solution,is superior to the common copper plating technology.
中图分类号 TQ153.1
所属栏目 应用技术
基金项目
收稿日期 2006/5/29
修改稿日期 2006/7/25
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引用该论文: XU Gui-ying. A NEW TECHNOLOGY OF NONMETALLIC ELECTROLESS COPPER PLATING[J]. Corrosion & Protection, 2006, 27(12): 642～644
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参考文献
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【3】曾梁华,吴仲达,陈钧武,等.电镀工艺手册[M].北京:机械工业出版社,1989.
【2】姜晓霞,沈 伟.化学镀理论与实践[M].北京:国防工业出版社,2000.
【3】曾梁华,吴仲达,陈钧武,等.电镀工艺手册[M].北京:机械工业出版社,1989.
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