三氯化铁溶液中影响铁镍合金蚀刻速率的因素
INFLUENCING FACTORS ON ETCHING RATES OF IRON NICKEL ALLOY FOILS IN FERRIC CHLORIDE SOLUTION
摘 要
采用浸渍蚀刻的方法,研究了影响Fex(x=56~59)Ni1-x合金箔在三氯化铁溶液中蚀刻速率的几个因素,并对蚀刻液的有效蚀刻能力及失效蚀刻液的除镍和再生进行了初步的研究.研究结果表明:氧化还原电位随蚀刻液浓度的增大而升高,氧化还原电位越高,蚀刻反应趋势越大；蚀刻速率随浓度的增加先增大,再下降,且在浓度为40%左右出现极大值；蚀刻液温度越高、pH值越小,蚀刻速率越大；除镍后的失效蚀刻液经再生后能达到新鲜蚀刻液的90%以上,基本达到再生利用的要求.
蚀刻速率
再生
FeCl3蚀刻废液
Fe-Ni alloy
Etching rate
Regeneration
FeCl3 etching solution
Abstract
Several factors affecting the etching rates of Fex(x=56~59)Ni1-x alloy foils in FeCl3 etchant were studied with an immersion etching method.Especially,the quantity of Fex(x=56-59)Ni1-x alloy foils being dissolved in FeCl3 etchant,regeneration of spent etchants and replacement of nickel ions in FeCl3 waste etchants were also studied.The redox potential of etchants increased with increasing etchant concentration.The higher the redox potential,the bigger the etching trend.And the etching rate increased at first and then decreased with increasing concentration.The max of rate appeared when the concentration was about 40%.Etching rate increased with increasing temperature and decreasing pH.
中图分类号 TG172.6 TB34
所属栏目 试验研究
基金项目
收稿日期 2006/7/4
修改稿日期 2006/9/11
网络出版日期
作者单位点击查看
引用该论文: LIU Piao,DU Yong-guo,ZHANG Wei-jun,LU Yu-feng,YANG Juan,MA Zhan-dong. INFLUENCING FACTORS ON ETCHING RATES OF IRON NICKEL ALLOY FOILS IN FERRIC CHLORIDE SOLUTION[J]. Corrosion & Protection, 2007, 28(5): 238～241
共有人对该论文发表了看法，其中：
人认为该论文很差
人认为该论文较差
人认为该论文一般
人认为该论文较好
人认为该论文很好
参考文献
【1】Kim J G,Han K H,Song S H,et al.Magnetic properties of sputtered soft magnetic Fe-Ni films with an uniaxial anisotropy[J].Thin Solid Films,2003,440:54-59.
【2】Tabakovic I,Riemer S,Vas,et al,Effect of magnetic field on electrode reactions and properties of electrodeposited NiFe films[J].J Electrochem Soc,2003,150(9):C635-C640.
【3】Czerwinski F,SzpunarJ A,Erb U.Structural and magnetic characterization of nanocrystalline Ni-20%Fe permalloy films[J].Journal of Materials Science:Materials in Electronics,2000,11:243-251.
【4】Robertson N,Lu H L,Tsang C.High performance write head using NiFe 45/55[J].IEEE Trans Magn,1997,33:28-18.
【5】蔡坚,马莒生,汪刚强,等.FeCl3溶液中影响Cu蚀刻速度的因素[J].中国有色金属学报,1998,8(Suppl.1):61-65.
【6】Takashi M.The 12th international conference on solid state sensors[C].Actuators and Microsystems,Boston,2003:1542-1545.
【7】李陵川,马莒生,唐祥云.用阴极极化的方法衡量FeNi42合金在三氯化铁蚀刻液中的蚀刻速度[J].中国有色金属学报,1997,7(1):112-116.
【8】杨云霞,王燕,张蕾.FeCl3蚀刻废液的除镍研究[J].华东理工大学学报,2001,27(3):320-322.
【9】李志勇,陶志刚,穆道彬,等.含ZrFeNi42合金再结晶及蚀刻性能的研究[J].功能材料,1999,30(4):364-365.
【10】陈天玉.不锈钢表面处理技术[M].北京:化学工业出版社,2004:374-380.
【11】黄桂桥.金属在海水中的腐蚀电位研究[J].腐蚀与防护,2000,21(1):8-11.
【2】Tabakovic I,Riemer S,Vas,et al,Effect of magnetic field on electrode reactions and properties of electrodeposited NiFe films[J].J Electrochem Soc,2003,150(9):C635-C640.
【3】Czerwinski F,SzpunarJ A,Erb U.Structural and magnetic characterization of nanocrystalline Ni-20%Fe permalloy films[J].Journal of Materials Science:Materials in Electronics,2000,11:243-251.
【4】Robertson N,Lu H L,Tsang C.High performance write head using NiFe 45/55[J].IEEE Trans Magn,1997,33:28-18.
【5】蔡坚,马莒生,汪刚强,等.FeCl3溶液中影响Cu蚀刻速度的因素[J].中国有色金属学报,1998,8(Suppl.1):61-65.
【6】Takashi M.The 12th international conference on solid state sensors[C].Actuators and Microsystems,Boston,2003:1542-1545.
【7】李陵川,马莒生,唐祥云.用阴极极化的方法衡量FeNi42合金在三氯化铁蚀刻液中的蚀刻速度[J].中国有色金属学报,1997,7(1):112-116.
【8】杨云霞,王燕,张蕾.FeCl3蚀刻废液的除镍研究[J].华东理工大学学报,2001,27(3):320-322.
【9】李志勇,陶志刚,穆道彬,等.含ZrFeNi42合金再结晶及蚀刻性能的研究[J].功能材料,1999,30(4):364-365.
【10】陈天玉.不锈钢表面处理技术[M].北京:化学工业出版社,2004:374-380.
【11】黄桂桥.金属在海水中的腐蚀电位研究[J].腐蚀与防护,2000,21(1):8-11.
相关信息
