EFFECTS OF ELECTROGRAINING CONDITIONS USED FOR PS PLATE ON GRAIN PARAMETERS
摘 要
通过模拟电解磨版的工业化生产条件,研究了在盐酸电解体系下电解磨版条件对砂目参数的影响规律.盐酸的浓度在0.008~0.016 g/ml的范围内,高度方面的砂目参数(Ra、Rz、Rq)随着盐酸浓度的升高均呈下降的趋势,而Rt、Ry、Sm(间距参数)先呈下降趋势,到盐酸浓度为0.014 g/ml时开始变为上升趋势;随着温度的升高,Ra、Rz、Rt、Rq、Ry、Sm都呈上升的趋势,并且会使砂目分布趋于均匀;随着电流密度的增大,Ra、Rz、Ry均呈上升趋势,Rt、Rq基本保持不变,Sm有一个峰值; 随着电量密度的增加,Ra、Rz、Rt、Rq、Ry、Sm都呈上升的趋势.
Abstract
The effects of electrograinning conditions used for PS plate on grain parameters were studied by simulating industrialization conditions of electrograining in HCl system.Between 0.008~0.016 g/ml of HCl,Ra,Rz and Rq all descended with increasing the concentration of HCl.Rt,Ry and Sm descended at first with decreasing the concentration of HCl,then began to rise at 0.014 g/ml of HCl.With increasing the temperature,Ra,Rz,Rt,Rq,Ry and Sm all inreased and the grains became uniform.With increasing the electric current density,Ra,Rz and Ry all increased and Rt,Rq did not change markedly and Sm had a peak.With increasing the electric quantity density,Ra,Rz,Rt,Rq,Ry,Sm all increased.
中图分类号 TG172.6 TS804
所属栏目 试验研究
基金项目
收稿日期 2006/7/12
修改稿日期 2006/7/22
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引用该论文: YANG Qing-hai. EFFECTS OF ELECTROGRAINING CONDITIONS USED FOR PS PLATE ON GRAIN PARAMETERS[J]. Corrosion & Protection, 2007, 28(6): 286~288
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参考文献
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【2】Thompson G E,Wood.A study of ac electrolytic graining of aluminium in hydrochloric[J].Corros Sci,1978,18:72.
【3】Lin C S,Chang C C ,Fu H M.Ac electrograining of aluminum plate in hydrochloric acid[J].Materals Chem And Phys,2001,68:217-224.
【4】Lin C S,Fu S M.Etch film and pit structure of AA1050 aluminium plates electrograined in nitric and hydrochloric acids[J].Jour of Electrochem Sci,2001,148:240-246.
【5】Bockris M,Reddy A K N.Ion transport in solutions[J].Modern Electrochemistry,1972,1:325.
【6】Terryn H,Vereecken J,Thompson G E.Ac electrograining of aluminum plate in hydrochloric acid[J].Trans Inst Met Finish,1988,66:116.
【7】Laevers P,Terryn H,Vereechen J,et al.A study of the mechanism of A.C.electrolytic graining of aluminium in hydrochloric and nitric acid[J].Corros Sci,1993,35:231-238.
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