甲基磺酸盐电镀锡工艺及镀液性能
PROCESS AND THE SOLUTION PROPERTIES OF METHANESULFONIC ACID TIN PLATING
摘 要
甲基磺酸盐电镀锡工艺能克服硫酸盐和氟硼酸盐电镀锡工艺镀液不稳定的缺点,而且对环境友好.通过正交试验确定该工艺最佳配方,在最佳条件下进行电镀锡液试验,结果表明甲基磺酸盐镀锡液具有较高的抗氧化和宽温施镀能力,镀液的深镀能力、均镀能力高.
电镀锡
镀液
Methanesulfonic acid
Tin-plating
Plating solution
Abstract
Methanesulfonic acid series tin-plating process can completely eliminate the defects of domestic present tin-plating process,for example,the unstable solution of sulfate plating and environmental pollution of fluoborate plating.The optimal conditions of methanesulfonic acid tin-plating process were determined by orthogonal experiments.The study on solution of methanesulfonic acid series tin-plating shows that oxidation resistance of the solution is good,range of the temperature of operation is wide,capability of deep plating and homogeneous plating are good.So it is very promising for tin-plating industry.
中图分类号 TQ153.1+3
所属栏目 应用技术
基金项目
收稿日期 2007/3/5
修改稿日期 2007/3/22
网络出版日期
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引用该论文: YE Xiao-yan,LI Li-qing. PROCESS AND THE SOLUTION PROPERTIES OF METHANESULFONIC ACID TIN PLATING[J]. Corrosion & Protection, 2007, 28(8): 422～424
被引情况:
【1】李立清,陈早明, "甲基磺酸盐电镀锡的镀层性能",腐蚀与防护 28, 534-535(2007)
【2】阴子良,叶东东,陈广,陈建钧, "甲基磺酸盐电镀锡工艺参数对镀层结合力影响",腐蚀与防护 36, 1124-1128(2015)
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参考文献
【1】曾华梁,吴仲达,陈均武,等.电镀工艺手册[M].北京:机械工业出版社,2002.
【2】Zhan,Abs J A,Chen C H,et al.An A1temative Surface Finish for Tin-Lead Solders[J].Plating＆Surface Finishing,1998,85(6):105.
【3】赵复荣.酸性光亮镀锡[J].电镀与涂饰,2001,20(4):62-63.
【4】肖友军.稀土催化剂抗酸性镀锡液氧化变质的研究[J].电镀与涂饰,2001(8):20.
【2】Zhan,Abs J A,Chen C H,et al.An A1temative Surface Finish for Tin-Lead Solders[J].Plating＆Surface Finishing,1998,85(6):105.
【3】赵复荣.酸性光亮镀锡[J].电镀与涂饰,2001,20(4):62-63.
【4】肖友军.稀土催化剂抗酸性镀锡液氧化变质的研究[J].电镀与涂饰,2001(8):20.
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