采用极化曲线、金相观察、赫尔槽电镀试验、弯曲试验和质谱分析方法,研究了氨基磺酸盐镀镍的阳极行为,证明了当在氨基磺酸盐镀液中使用电解镍阳极时,其活化峰值电流和镀液组成有很大的相关性,当镀液中不含F-和Cl-时其阳极活化峰值电流小,阳极处于极化状态,或相当大面积处于极化状态,使氨基磺酸根在极化的阳极表面氧化,从而使含硫化合物夹附于镀镍层,形成镀层内应力,并使镀层成为层状结构,并出现半光亮的外观.经热处理后,原来的层状结构不复存在,使镀层韧性变差,同时,由于热处理过程中硫和镍形成了脆性的硫化镍更使镀层脆性转甚,其表现往往是镀层受拉伸、弯折和压印时易断裂或形成碎片.

The anodic behavior of electrolytic nickel anode in nickel sulfamate plating Solution was investigated,using anodic polarization curves ,metallographic observation of cross-sections of nickel deposits,Hull Cell tests with solutions with and without Cl-,F-,bending tests with five solutions of different compositions,and sulfur content analysis in nickel deposit with mass spectrometry.Anodic behavior was significantly affected by bath composition,especialy Cl- and F-.The deposits prepared from the solution without Cl- and F- showed better ducitility and laminated structure than those with Cl- and F-.But after heat treatment,laminated structure no longer existed and ductility decreased.