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合理使用划痕法及显微法测定TiN薄膜与基体结合力
          
Rational Use of Scratching Method and Microscopic Method on Measurement of TiN Film-substrate Adhesion Strength

摘    要
采用反应磁控溅射的方法在TC4钛合金基板上制备了TiN薄膜,利用划痕法测试了TiN薄膜与基体之间的结合力,并结合薄膜硬度与显微法判断的临界载荷进行了对比分析.结果表明:单纯依靠划痕法判断临界载荷较为局限,结合显微法同时考虑硬度等力学性能共同判断临界载荷,是更为科学合理的办法.
标    签 划痕法   显微法   TiN薄膜/基体结合力   硬度   scratching method   microscopic method   TiN film-substrate adhesion strength   hardness  
 
Abstract
TiN film was deposited on TC4 titanium substrate by reactive magnetron sputtering method.Adhesion strength of TiN film and substrate was measured by scratching method.The critical load determined by scratching method and microscopic method was contrasted and analyzed combined with hardness data.The results show that it was restrictive to judge the critical load only relying on scratching method.It would be more scientific and reasonable to judge the critical load by scratching method combined with microscopic method and mechanical properties such as hardness.

中图分类号 O484.2   DOI 10.11973/lhjy-wl201509005

 
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所属栏目 试验技术与方法

基金项目 中央高校基本科研业务费资助项目(N120309001,N140904002);教育部科学技术研究重大项目资助项目(313014)

收稿日期 2014/11/4

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备注肖娜(1981-),女,实验师,博士.

引用该论文: XIAO Na,DU Fei-fei. Rational Use of Scratching Method and Microscopic Method on Measurement of TiN Film-substrate Adhesion Strength[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2015, 51(9): 619~622
肖娜,杜菲菲. 合理使用划痕法及显微法测定TiN薄膜与基体结合力[J]. 理化检验-物理分册, 2015, 51(9): 619~622


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