Rational Use of Scratching Method and Microscopic Method on Measurement of TiN Film-substrate Adhesion Strength
摘 要
采用反应磁控溅射的方法在TC4钛合金基板上制备了TiN薄膜,利用划痕法测试了TiN薄膜与基体之间的结合力,并结合薄膜硬度与显微法判断的临界载荷进行了对比分析.结果表明:单纯依靠划痕法判断临界载荷较为局限,结合显微法同时考虑硬度等力学性能共同判断临界载荷,是更为科学合理的办法.
Abstract
TiN film was deposited on TC4 titanium substrate by reactive magnetron sputtering method.Adhesion strength of TiN film and substrate was measured by scratching method.The critical load determined by scratching method and microscopic method was contrasted and analyzed combined with hardness data.The results show that it was restrictive to judge the critical load only relying on scratching method.It would be more scientific and reasonable to judge the critical load by scratching method combined with microscopic method and mechanical properties such as hardness.
中图分类号 O484.2 DOI 10.11973/lhjy-wl201509005
所属栏目 试验技术与方法
基金项目 中央高校基本科研业务费资助项目(N120309001,N140904002);教育部科学技术研究重大项目资助项目(313014)
收稿日期 2014/11/4
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备注肖娜(1981-),女,实验师,博士.
引用该论文: XIAO Na,DU Fei-fei. Rational Use of Scratching Method and Microscopic Method on Measurement of TiN Film-substrate Adhesion Strength[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2015, 51(9): 619~622
肖娜,杜菲菲. 合理使用划痕法及显微法测定TiN薄膜与基体结合力[J]. 理化检验-物理分册, 2015, 51(9): 619~622
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参考文献
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【3】MADY C E K,RODRIGUEZ S A,GMEZ A G,et al.Effects of mechanical properties:Residual stress and indenter tip geometry on instrumented indentation data in thin films[J].Surface and Coatings Technology,2010,205(5):1393-1397.
【4】HU R H,LIM J K.Hardness and wear resistance improvement of surface composite layer on Ti-6Al-4V substrate fabricated by powder sintering[J].Materials & Design,2010,31(5):2670-2675.
【5】BANSAL D G,ERYILMAZ O L,BLAU P J.Surface engineering to improve the durability and lubricity of Ti-6Al-4V alloy[J].Wear,2011,271(9/10):2006-2015.
【6】ZHOU Y,RAO G B,WANG J,et al.Influence of Ti/TiN bilayered and multilayered films on the axial fatigue performance of Ti46Al8Nb alloy[J].Thin Solid Films,2011,519(7):2207-2212.
【7】崔彩娥,缪强,潘俊德.薄膜与基体间的附着力测试[J].电子工艺技术,2006,26(5):294-297.
【8】BENJAMIN P,WEAVER C.Measurement of adhesion of thin films[J].Proceedings of the Royal Society of London:Series A Mathematical and Physical Sciences,1960,254(1277):163-176.
【9】黄书泽,丁彪,邹凤平,等.试验载荷对维氏硬度测试误差的影响[J].理化检验-物理分册,2014,50(2):189-192.
【10】张高兰,杨爱民,马星,等.维氏硬度检验中拖尾现象分析和偏差估算[J].理化检验-物理分册,2014,50(10):738-747.
【11】杜军,张平,赵军军,等.显微硬度法与纳米压入法测量微米级硬质薄膜硬度的比较[J].理化检验-物理分册,2008,44(4):189-192.
【12】YANG Gen-qing,WANG Da-zhi,LIU Xiang-huai,et al.Formation of nanocrystalline TiN films by ion-beam-enhanced deposition[J].Surface and Coatings Technology,1994,65(1):214-218.
【13】HOANG N H,MCKENZIE D R,MCFALL W D,et al.Properties of TiN films deposited at low temperature in a new plasma-based deposition system[J].Journal of Applied Physics,1996,80(11):6279-6285.
【14】ZHANG L,YANG H,PANG X,et al.Microstructure,residual stress,and fracture of sputtered TiN films[J].Surface and Coatings Technology,2013,224:120-125.
【15】LJUNGCRANTZ H,HULTMAN L,SUNDGREN J E,et al.Residual stresses and fracture properties of magnetron sputtered Ti films on Si microelements[J].Journal of Vacuum Science & Technology:A,1993,11(3):543-553.
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