Quick Curing Epoxy Resin at Room-temperature
摘 要
以环氧树脂E-51和T-31固化剂为主体研究了一种新型的室温快速固化环氧树脂体系.对树脂的配方、固化行为和力学性能进行了研究.结果表明:树脂体系能在30min左右固化;在清洁粘接面的抗剪强度达到15.56MPa,油面抗剪强度能达到9.85MPa;树脂固化物的抗拉强度达到36.11MPa,但冲击性能稍差.
Abstract
Epoxy resin (E-51) and curing agent (T-31) had been applied to develop a room-temperature and quick curing resin.The batch formula,curing behavior and mechanical properties of that resin were investigated.The resin cured within 30 minutes.Shear strength reached 15.56MPa on the clear surface and 9.85MPa on the oil-covered surface respectively.Tensile strength of the cured resin was 36.11MPa.However,shock resistance of the cured resin was poor.
中图分类号 TB332
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收稿日期 2004/12/20
修改稿日期 2005/3/20
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备注朱锦波(1981-),男,湖南汝城人,硕士研究生.
引用该论文: ZHU Jin-bo,SANG Xiao-ming,YANG Xian-jin,CUI Zhen-duo,ZHU Sheng-li,ZHANG Guang-hua. Quick Curing Epoxy Resin at Room-temperature[J]. Materials for mechancial engineering, 2006, 30(4): 44~45
朱锦波,桑晓明,杨贤金,崔振铎,朱胜利,张光华. 室温快固型环氧树脂的研究[J]. 机械工程材料, 2006, 30(4): 44~45
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参考文献
【1】金伶.用添加剂改进环氧塑料模具综合性能的研究[J].机械工程材料,1996,20(3):18-21.
【2】陈维军,张恩天,郭旭,等.室温固化环氧胶粘剂的研究现状与发展趋势[J].化学与粘合,2000,(3):127-129.
【3】孙曼灵.环氧树脂应用原理与技术[M].北京:机械工业出版社,2002.388-400.
【4】程时远,陈正国.胶黏剂生产与应用手册[M].北京:化学工业出版社,2003.29-35.
【5】Bardoliwalla,Denny F.Fast curing,low exotherm epoxy potting and encapsulating systems[A].Proceedings of the Electrical/Electronics Insulation Conference[C].Rosemont,IL,USA Sponsor:IEEE,1997.245-247.
【6】王德生,陈维,刘斌,等.环氧浇铸体固化过程放热研究[J].玻璃钢/复合材料,1999,(5):27-29.
【7】朱明,赵世琦,张炜.T31室温固化环氧树脂粘接性能的研究[J].化学建材,2000,(3):27-30.
【8】丘建辉.快固型吸油性胶粘剂的试验研究[J].南京航空航天大学学报,1996,28(2):182-186.
【9】John W.Harp,Minneapolis,William L.Minarik,et al.Method of bonding oil-filmed surfaces with a solvent-free epoxy resin[P].United States,3551249,1970-12-29.
【10】王德中.环氧树脂生产与应用[M].北京:化学工业出版社,2001.703-704.
【2】陈维军,张恩天,郭旭,等.室温固化环氧胶粘剂的研究现状与发展趋势[J].化学与粘合,2000,(3):127-129.
【3】孙曼灵.环氧树脂应用原理与技术[M].北京:机械工业出版社,2002.388-400.
【4】程时远,陈正国.胶黏剂生产与应用手册[M].北京:化学工业出版社,2003.29-35.
【5】Bardoliwalla,Denny F.Fast curing,low exotherm epoxy potting and encapsulating systems[A].Proceedings of the Electrical/Electronics Insulation Conference[C].Rosemont,IL,USA Sponsor:IEEE,1997.245-247.
【6】王德生,陈维,刘斌,等.环氧浇铸体固化过程放热研究[J].玻璃钢/复合材料,1999,(5):27-29.
【7】朱明,赵世琦,张炜.T31室温固化环氧树脂粘接性能的研究[J].化学建材,2000,(3):27-30.
【8】丘建辉.快固型吸油性胶粘剂的试验研究[J].南京航空航天大学学报,1996,28(2):182-186.
【9】John W.Harp,Minneapolis,William L.Minarik,et al.Method of bonding oil-filmed surfaces with a solvent-free epoxy resin[P].United States,3551249,1970-12-29.
【10】王德中.环氧树脂生产与应用[M].北京:化学工业出版社,2001.703-704.
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