铁粉法与甲醛法在石墨粉表面化学镀铜的工艺对比
Processing Technology of Electroless Copper Plating on Graphite Powder by Iron Powder and Formaldehyde
摘 要
研究比较了两种化学方法——铁粉法和甲醛法在石墨粉表面镀铜的工艺.结果表明：铁粉法使用混合表面活性剂对石墨粉预处理,40~60 ℃搅拌下缓慢加入镀液,在pH为1.5~2.0下镀覆15~20 min, 50 ℃干燥可以制备出含铜25%~75%、镀覆效果好的镀铜石墨粉:甲醛法要求对石墨粉敏化、活化、工艺复杂、成本高、副反应产物具有毒性,且铜含量较低的试样镀覆效果不如铁粉法制备的试样.铁粉法镀覆效果好、工艺简单、无毒,列为首选方法.
镀铜
化学镀
graphite powder
copper plating
electroless plating
Abstract
The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.The iron powder method could produce highly covered copper/graphite powders with 25%-75% copper under processing following conditions:graphite powders being pretreated by complex surfactants,plating solution added slowly,graphite and iron powders agitated at 40-60 ℃,electroless copper plated for 15-20 minutes at 1.5-2.0 pH and dried at 50 ℃.Sensitization and activation processes were very important stages in formaldehyde method.Because of the expensive reagent and low covering rate of copper/graphite powders and poisonous by-product in the formaldehyde method,the iron powder method is recommended.
中图分类号 TQ153.3
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收稿日期 2006/7/20
修改稿日期 2006/10/20
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备注余泉茂(1974-),男,江西余江人,副教授,博士.
引用该论文: YU Quan-mao. Processing Technology of Electroless Copper Plating on Graphite Powder by Iron Powder and Formaldehyde[J]. Materials for mechancial engineering, 2007, 31(6): 15～18
余泉茂. 铁粉法与甲醛法在石墨粉表面化学镀铜的工艺对比[J]. 机械工程材料, 2007, 31(6): 15～18
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参考文献
【1】池上隆敏.石墨颗粒的镀铜法:日本,昭58-8792[P],1983.
【2】黄鑫,王贵青,贺子凯.石墨粉表面化学镀铜工艺研究[J].机械工程材料,2002,26(11):33-35.
【3】Liu Y,Nath D.Compacting characteristics of aluminous,copper and graphite powder mixtures[J].P M L,1990,22(2):16-19.
【4】王文芳,许少凡,应美芳.用镀铜石墨粉制备铜-石墨复合材料[J].机械工程材料,1999,23(2):41-43.
【5】熊海平,萧以德,伍建华,等.化学镀铜的进展[J].表面技术,2002,31(6):5-11.
【6】Yu Quanmao,Wu Yishan.Research on action of surfactants in process of coating copper on graphite powder[J].Non-metallic Mines,1999,22(3):4-5.
【7】郑水林.十二烷基硫酸钠在石墨浮选中的应用机理的研究[D].武汉:武汉建筑材料学院,1984.
【8】Abel Philip B,Borenyi-Both,Andras L.Study of copper on graphite with tianium or chromium bond layer[J].Journal of Materials Reseach,1988,9(3):38-42.
【9】李艳,肖清贵.镀铜石墨粉的制备研究[J].表面技术,2006,35(1):160-62.
【10】王贵清,孙加林,陈敬超.石墨颗粒表面化学镀铜研究[J].表面技术,2003,32(1):36-40.
【2】黄鑫,王贵青,贺子凯.石墨粉表面化学镀铜工艺研究[J].机械工程材料,2002,26(11):33-35.
【3】Liu Y,Nath D.Compacting characteristics of aluminous,copper and graphite powder mixtures[J].P M L,1990,22(2):16-19.
【4】王文芳,许少凡,应美芳.用镀铜石墨粉制备铜-石墨复合材料[J].机械工程材料,1999,23(2):41-43.
【5】熊海平,萧以德,伍建华,等.化学镀铜的进展[J].表面技术,2002,31(6):5-11.
【6】Yu Quanmao,Wu Yishan.Research on action of surfactants in process of coating copper on graphite powder[J].Non-metallic Mines,1999,22(3):4-5.
【7】郑水林.十二烷基硫酸钠在石墨浮选中的应用机理的研究[D].武汉:武汉建筑材料学院,1984.
【8】Abel Philip B,Borenyi-Both,Andras L.Study of copper on graphite with tianium or chromium bond layer[J].Journal of Materials Reseach,1988,9(3):38-42.
【9】李艳,肖清贵.镀铜石墨粉的制备研究[J].表面技术,2006,35(1):160-62.
【10】王贵清,孙加林,陈敬超.石墨颗粒表面化学镀铜研究[J].表面技术,2003,32(1):36-40.
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