SiCp/Cu复合材料的显微组织和力学性能
Microstructure and Mechanical Properties of SiCp/Cu Composites
摘 要
采用非均相沉淀包裹法制得铜包SiC复合粉体,利用热压烧结工艺制备了含有体积分数为20%～65%SiC颗粒的SiCp/Cu复合材料.用X射线衍射仪、扫描电镜、能谱分析等测试方法对试样进行了成分和微观形貌分析.结果表明：包裹法制得的SiCp/Cu复合材料中基体铜形成连续的结构,SiC分散较均匀;随着SiC含量的增加,试样孔隙率提高,抗弯强度下降;而硬度则先增后降,并在SiC体积分数为35%时出现最大值;所有试样均表现为脆性断裂.
包裹
热压烧结
SiCp/Cu composite
coating
hot pressing process
Abstract
Cu coated SiC composite powders were made by the heterogeneous precipitation coating method and the hot pressing process was used to prepare SiCp/Cu composites with 20%-65%SiC particles.The composition and microstructure of samples were characterized by X-ray diffraction,SEM with EDS.Continuous matrix copper is obtained in the composites with the SiC particles distributed uniformly.The porosity of the composites increase,but the flexural strength decrease with increasing fraction of SiCp.The composites with 35%SiCp show the highest hardness.All samples exhibit brittle fracture behavior.
中图分类号 TB303
所属栏目
基金项目 河南省杰出青年科学基金资助项目(512002200)
收稿日期 2006/9/14
修改稿日期 2007/1/26
网络出版日期
作者单位点击查看
备注王春华(1965-),男,河南上蔡人,博士研究生.
引用该论文: WANG Chun-hua,GUAN Shao-kang,ZHANG Rui. Microstructure and Mechanical Properties of SiCp/Cu Composites[J]. Materials for mechancial engineering, 2007, 31(9): 48～50
王春华,关绍康,张锐. SiCp/Cu复合材料的显微组织和力学性能[J]. 机械工程材料, 2007, 31(9): 48～50
被引情况:
【1】宝峰,曲选辉,何新波,孙本双, "SiC含量对注射成形SiCp/Cu复合材料磨损性能的影响侯",机械工程材料 34, 67-69(2010)
【2】王春华,樊雪琴,关绍康,张锐, "SiC颗粒表面处理对SiC/Cu复合材料性能的影响",机械工程材料 34, 36-39(2010)
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参考文献
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【2】王伟,许晓静.添加少量纳米SiCp对铜基材料电学和摩檫学性能的影响[J].机械工程材料,2005,29(4):20-22.
【3】Wu T F,Qiu Z W,Lee S L,et al.Effects of graphite on wear and corrosion behaviour of SiCp-reinforced copper matrix composites formed by hot pressing[J].Corros Eng Sci Technol,2004,39(3):229-235.
【4】Lee Y F,Lee S L,Lin J C.Wear and corrosion be haviors of SiCp reinforced copper matrix composites formed by hot pressing[J].Scand J Metall,1999,28(1):9-16.
【5】Park J S,Landry K.Kinetic control of silicon carbide/metal reactions[J].Mater Sci Eng A,1999,259(2):279-286.
【6】Delannay F,Froyen L,Deruyttere A.Review:the wetting of solids by molten metals and its relation to the preparation of metal-matrix composites[J].J Mater Sci,1987,22(1):1-16.
【7】Zhang R,Gao L,Guo J K.Influence of Cu2O on interface behavior of copper/SiCp composites prepared by spark plasma sintering[J].J Am Ceram Soce,2004,87(2):302-304.
【8】Zhang R,Gao L,Guo J K.Preparation and characterization of coated nanoscale Cu/SiCp composites particlec[J].Ceram Inter,2004,30(3):401-404.
【9】Yih P,Chung D D L.A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal-matrix composites[J].J Mater Sci,1997,32(11):2873-2882.
【10】Lee Y F,Lee S L,Chung C L,et al.Effects of SiCp reinforcement by electroless copper plating on properties of Cu/SiCp composites[J].Powder Metall,1999,42(2):147-152.
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