Numerical Simulation of Unique Boundary Layer Effect during Powder Injection Molding Filling Flow Process
摘 要
基于粉末-粘结剂的双流体模型,利用CFX软件粉末口射成形(PIM)对充模过程中粘结剂的分布变化进行了模拟计算.结果表明:在注射坯的表面薄层内粘结剂含量多于在注射坯中的平均值,且表面薄层内粘结剂体积分数由表到里逐渐下降,证实了PIM特有边界层效应的存在.随着注射温度由420 K升高到440 K,PIM特有的边界层效应变明显;随着入口的喂料流量由60 cm3·s-1增加到80 cm3·s-1,这种效应反而略有减轻.试验结果与模拟结果基本一致,表明了双流体模型用于PIM研究的可靠性.
Abstract
The change of binder volume fraction was simulated by CFX software based on the two-fluid model during poweler injection molding(PIM) filling flow.The results show that the binder content of the thin surface layer is more than the mean of the whole injected parts.The volume fraction of the binder decreas gradually from surface to interior.So,the PIM unique boundary layer effect is verified.The effect would be amplified gradually as the temperature of injection increased from 420 K to 440 K,but it is lightened as the flow rate increased from 60 cm3·s-1 to 80 cm3·s-1.It is fitted with the practice results basically,so the two-fluid model is reliable to study the PIM filling flow.
中图分类号 TF12
所属栏目
基金项目 国家自然科学基金重点资助项目(50634010);国家重点基础研究发展规划资助项目(G2000067203);国家杰出青年科学基金资助项目(50025412)
收稿日期 2007/3/28
修改稿日期 2007/5/30
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备注王玉会(1977-),女,河北保定人,博士研究生.
引用该论文: WANG Yu-hui,QU Xuan-hui,HE Xin-bo,ZHANG Yong,LIN Bing-tao,ZANG Ruo-yu. Numerical Simulation of Unique Boundary Layer Effect during Powder Injection Molding Filling Flow Process[J]. Materials for mechancial engineering, 2008, 32(2): 77~80
王玉会,曲选辉,何新波,张勇,林冰涛,藏若愚. 粉末注射成形充模过程特有边界层效应的数值模拟[J]. 机械工程材料, 2008, 32(2): 77~80
被引情况:
【1】邓朝晖,伍俏平,言佳颖,万林林, "金刚石/铜基粉末注射成形熔体温度对充填率影响的有限元模拟",机械工程材料 38, 93-96(2014)
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参考文献
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【4】刘大有.二相流体动力学[M].北京:高等教育出版社,1993:441-533.
【5】李静海,欧阳洁.颗粒流体复杂系统的多尺度模拟[M].北京:科学出版社,2005:144-155.
【6】Drew D A.Mathematical modeling of two-phase flow[J].Ann Rev Fluid Mech,1983,15:261-291.
【7】范小欣.MIM注射多相流模拟的各相本构和边界条件滑移[D].成都:西南交通大学,2006.
【8】Manninen M,Tavassalo V.On the Mixture Models for Multiphase Flow[M].New Ierk:VTT Publications,1996.
【9】Kwon T H,Ahn S Y.Slip characterization of powder/binder mixtures and its significance in the filling process analysis of powder injection molding[J].Powder Technology,1995,85:45-55.
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