单晶铜薄膜纳米压痕过程的分子动力学模拟
MD Simulation of Nanoindentation of Monocrystalline Copper Film
摘 要
使用三维分子动力学方法模拟了单晶铜薄膜的纳米压痕过程,研究了压头半径对纳米压痕过程的影响;采用Morse势函数计算试样原子与压头原子之间、试样原子之间的相互作用关系.结果表明:单晶铜薄膜纳米压痕的力学机理是非晶态产生的变形;纳米压痕过程具有尺寸效应,压头大小对单晶铜薄膜纳米压痕的分子动力学模拟结果有显著的影响.
分子动力学
单晶铜
薄膜
nanoindentation
molecular dynamics
monocrystalline copper
film
Abstract
Three-dimensional molecular dynamics (MD) simulation was conducted to study the effect of indenter size on the AFM-based nanoindentation process of monocrystalline copper film.The Morse potential was utilized to compute the interaction between workpiece atoms and tool atoms,and also the interaction between sample workpiece atoms.The results show that the plastic deformation via amorphous transformation is the mechanism of nanoindentation of monocrystalline copper film.The MD simulation results of nanoindentation process were significantly affected by the indenter size,indicating the nanoindentation size effect.
中图分类号 TG113.2
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收稿日期 2007/6/3
修改稿日期 2007/9/18
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备注黄跃飞(1975-),男,江西高安人,讲师,硕士.
引用该论文: HUANG Yue-fei,ZHANG Jun-jie,ZHOU Jun-hu. MD Simulation of Nanoindentation of Monocrystalline Copper Film[J]. Materials for mechancial engineering, 2008, 32(4): 81～83
黄跃飞,张俊杰,周军晖. 单晶铜薄膜纳米压痕过程的分子动力学模拟[J]. 机械工程材料, 2008, 32(4): 81～83
被引情况:
【1】张星,王鹤峰,袁国政,树学峰, "基于纳米压痕试验的316L不锈钢表面钛、TiN薄膜结合性能的有限元模拟",机械工程材料 37, 90-95(2013)
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参考文献
【1】Bhushan B.Nanoscale tribophysics and tribomechanics[J].Wear,1999,225/229:465-492.
【2】Landman U,Luedtke W D,Burnham N A,et al.Atomistic mechanisms and dynamics of adhesion,nanoindentation and fracture[J].Science,1990,248:454-461.
【3】Dzegilenko F N,Srivastava D,Saini S.Nanoscale etchingand indentation of silicon (111) surface with carbon nanotube tips[J].Nanotechnology,1999,10:253-257.
【4】Liu C L,Fang T H,Lin J F.Atomistic simulations of hard and soft films under nanoindentation[J].Materials Science and Engineering A,2007,452/453:135-141.
【5】霍德鸿,梁迎春,程凯,等.基于原子力显微镜和分子动力学的纳米压痕技术研究[J].机械工程学报,2004(6):39-44.
【6】Fang T H,Weng C I,Chang J G.Molecular dynamics analysis of temperature effects on nanoindentation measurement[J].Materials Science and Engineering A,2003,357:7-12.
【2】Landman U,Luedtke W D,Burnham N A,et al.Atomistic mechanisms and dynamics of adhesion,nanoindentation and fracture[J].Science,1990,248:454-461.
【3】Dzegilenko F N,Srivastava D,Saini S.Nanoscale etchingand indentation of silicon (111) surface with carbon nanotube tips[J].Nanotechnology,1999,10:253-257.
【4】Liu C L,Fang T H,Lin J F.Atomistic simulations of hard and soft films under nanoindentation[J].Materials Science and Engineering A,2007,452/453:135-141.
【5】霍德鸿,梁迎春,程凯,等.基于原子力显微镜和分子动力学的纳米压痕技术研究[J].机械工程学报,2004(6):39-44.
【6】Fang T H,Weng C I,Chang J G.Molecular dynamics analysis of temperature effects on nanoindentation measurement[J].Materials Science and Engineering A,2003,357:7-12.
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