制备工艺对铜包裹MoSi2复合粉体热稳定性的影响
Effect of Preparation Technology on Thermal Stability of Cu Coated MoSi2 Composite Particles
摘 要
采用非均相形核法制备了铜包裹MoSi2复合粉体,采用X射线衍射仪分析了复合粉体的物相组成,用热分析仪分析了复合粉体在加热过程中的物理、化学变化.结果表明:所制备的复合粉体在室温～1 000 ℃时,铜和MoSi2未发生化学反应,两者具有很好的化学稳定性；在酸性(HCl)环境中制备的复合粉体中存在氧氯化铜,它在250 ℃左右分解为CuO、CuCl并释放出水蒸气,在420 ℃左右CuCl熔化,800 ℃左右CuO分解为Cu2O并释放出氧气；在中性环境中加入壬基酚聚氧乙烯醚作为分散剂制备的复合粉体中,铜的氧化程度降低,从室温升到1 000 ℃只存在CuO的分解;MoSi2颗粒越细小,Cu2O微晶的形核率越高,晶粒尺寸越小,CuO的分解温度越高.
MoSi2
非均相形核
热稳定性
copper
MoSi2
heterogeneous nucleation
thermostability
Abstract
Cu coated MoSi2 composite particles were prepared by heterogeneous nucleation method.X-ray diffraction (XRD) was used to determine the phases of the Cu coated MoSi2 composite particles.Differential scanning catorometer(DSC) was used to characterize the thermophysical and thermochemical behaviors of the particles.The results indicate that no chemical reaction occurred between Cu and MoSi2 in the range from room temperature to 1 000 ℃.There was Cu2Cl(OH)3 in the particles prepared in the HCl acid solution,and it decomposed to CuO and CuCl with vapor releasing at about 250 ℃.CuCl melted at about 420 ℃.CuO decomposed to Cu2O and O2 at about 800 ℃.The stability of the particals improved when they were prepared in the aqueous solution using alkylphenol ethoxylates as the modificatec,only decomposition reaction of CuO occurred in the range of room temperature to 1 000 ℃.The finer the particles of MoSi2 were ,the higher the nucleation rate was.And the finer the Cu grains were,and the higher the decomposition temperature of CuO formed from oxidation was.
中图分类号 TB333
所属栏目 材料性能及其应用
基金项目 甘肃省自然基金资助项目(3ZS061-A25-038)
收稿日期 2008/3/10
修改稿日期 2008/6/14
网络出版日期
作者单位点击查看
备注郭铁明(1969-),女,甘肃通渭人,副教授,硕士.
引用该论文: GUO Tie-ming,JI Gen-shun,MA Qin,ZHOU Qi,JIA Jian-gang. Effect of Preparation Technology on Thermal Stability of Cu Coated MoSi2 Composite Particles[J]. Materials for mechancial engineering, 2009, 33(3): 68～71
郭铁明,季根顺,马勤,周琦,贾建刚. 制备工艺对铜包裹MoSi2复合粉体热稳定性的影响[J]. 机械工程材料, 2009, 33(3): 68～71
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【3】ZHANG Rui,GAO Lian,GUO Jing-kun.Preparation and characterization of coated nanoscale Cu/SiC composite particles[J].Ceramics International,2004,30:401-404.
【4】LEE Y F,LEE S L,CHUANG C L,et al.Effect of SiCp rein-forcement by electroless copper plating on properties of Cu/SiCp composites[J].Powder Metall,1999,42(2):147-152.
【5】郭铁明,陈辉.包裹法制备MoSi2/Cu基合金复合粉体的影响因素探讨[J].热加工工艺,2008,37(2):5-8.
【6】陈磊,陈建敏,周惠娣,等.液相化学还原法制备纳米铜颗粒的研究[J].机械工程材料,2005,29(7):65-67.
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