集成电路用铜-镍-硅合金的动态再结晶行为
Dynamic Recrystallization Behavior of Cu-Ni-Si Alloy for Integrated Circuit Materials
摘 要
用Gleeble-1500D热模拟试验机对铜-镍-硅合金在应变速率0.01～5 s-1、变形温度600～800 ℃压缩条件下的流变应力及其动态再结晶行为进行了研究.结果表明:应变速率和变形温度对合金的动态再结晶行为影响较大,变形温度越高,应变速率越小,合金越容易发生动态再结晶;利用Arrhenius双曲正弦函数求得铜-镍-硅合金的热变形激活能为245.4 kJ·mol-1;得到的Zener-Hollomon指数函数形式为=e28.47[sinh(0.013σ)]5.52exp[-245.4×103/(RT)].
动态再结晶
物理热模拟
Cu-Ni-Si alloy
dynamic recrystallization
physical thermal simulation
Abstract
The rheologic stress and dynamic recrystallization behaviors of Cu-Ni-Si alloy during hot compression deformation process were investigated in the temperature range of 600-800 ℃ and strain rate range of 0.01-5 s-1 using Gleeble-1500D thermal-mechanical simulator.The results show that the dynamic recrystallization behavior was controlled by both strain rate and deforming temperature.The higher the temperature and the smaller the strain rate,the easier the dynamic recrystallization.The hot deformation activation energy of the Cu-Ni-Si alloy was gained by Arrhenius hyperbolic sine function to be 245.4 kJ·mol-1.With a Zener-Hollomon parameter in the exponent-type equation,analytical formula of strain rate was got as =e28.47[sinh(0.013σ)]5.52exp[-245.4×103/(RT)].
中图分类号 TG146.1
所属栏目 试验研究
基金项目 国家“863”计划资助项目(2006AA03Z528);国家自然科学基金资助项目(50571035);河南省杰出青年基金资助项目(0521001200)
收稿日期 2008/4/21
修改稿日期 2008/12/25
网络出版日期
作者单位点击查看
备注范莉(1984-),女,内蒙古包头人,硕士研究生.
引用该论文: FAN Li,LIU Ping,JIA Shu-guo,CHEN Shao-hua,YU Zhi-sheng. Dynamic Recrystallization Behavior of Cu-Ni-Si Alloy for Integrated Circuit Materials[J]. Materials for mechancial engineering, 2009, 33(6): 25～28
范莉,刘平,贾淑果,陈少华,于志生. 集成电路用铜-镍-硅合金的动态再结晶行为[J]. 机械工程材料, 2009, 33(6): 25～28
被引情况:
【1】罗宗强,刘宇轩,谭伟,白鸽玲,张卫文, "挤压温度对热挤压Cu-17Ni-3Al-X合金耐磨性能的影响",机械工程材料 39, 30-34(2015)
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【3】李红英,欧玲,张建飞,等.一种新型Al-Cu-Li系合金的热压缩流变应力[J].北京科技大学学报,2006,28(8):750-754.
【4】周晓华,柳瑞清.高温下几种铜合金流动应力的研究[J].上海有色金属,2003,24(1):16-18.
【5】王战锋,张辉,张昊,等.喷射沉积5A06铝合金热压缩变形的流变应力行为[J].中国有色金属学报,2006,11(16):1938-1944.
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【7】JONAS J,SELLARS C M,PEGART W J M.Strength and structure under hot working conditions[J].Tegar Int Metall Reviews,1969,130(14):1-24.
【8】TAKUDA H,FUJIMOTO H,HATTA N.Modeling on flow stress of Mg-Al-Zn alloys at elevated temperature[J].Journal of Materials Processing Technology,1998,80/81(8):513-516.
【9】SHEN G,SEMIATANTIN S L,ALTAN T.Investigation of flow stress and microstructure development in non-isothermal forging of Ti-6242[J].J Mater Process Technol,1993,36:303-307.
【10】SELLARS C M,TEGART W J M.La relation entre la resistance et structure dans le deformation a chaud[J].Mem Sci Rev Metall,1966,63:731-746.
【11】DAVENPOT S B,SILK N J,SPARKS C N,et al.Development of constitutive equations for modeling of hot rolling[J].Mater Sci and Technol,2000,16(5):539-546.
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【13】GAROFALO F.An empirical relation refining the stress dependence of minimum creep rate in metals[J].Trans Metall Soc AIME,1963,227(2):351-355.
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