过热度对Sn3Ag2.8Cu合金雾化粉体颗粒形貌的影响
Effect of Superheat on Particle Morphology of Atomized Sn3Ag2.8Cu Alloy Powders
摘 要
为了加速我国电子行业无铅化进程,利用自行设计的超音速雾化制粉试验装置,研究了过热度对Sn3Ag2.8Cu合金无铅焊锡雾化粉体颗粒形貌的影响.结果表明:通过调整合金的过热度,能够控制雾化粉体中卫星颗粒及异形颗粒的比例;当合金过热度为150 ℃时,雾化粉体中卫星颗粒和异形颗粒最少,颗粒球形度最好;当合金过热度为100 ℃时,雾化粉体颗粒球形度较差;当合金过热度为250 ℃时,雾化粉体卫星颗粒和片状颗粒较多.
无铅焊锡粉体
过热度
颗粒形貌
Sn3Ag2.8Cu alloy
lead-free solder powder
superheat
particle morphology
Abstract
To accelerate the lead-free process in the electronic industry in our country,the effect of superheat condition on morphology of the Sn3Ag2.8Cu alloy lead-free solder powder particles was studied by using self-designed supersonic atomization device.The results show that the proportion of the satellite particles and special shaped particles could be controlled through adjusting the superheat condition for the alloy.Under 150 ℃ superheat condition,the proportion of the satellite particles and special shaped particles were the least,and the sphericity of the particles was optimal.And the sphericity of the particles was worse under 100 ℃ superheat condition.There were more satellite particles and flake particles in the atomized powders under 250 ℃ superheat condition.
中图分类号 TF123.2
所属栏目 试验研究
基金项目 西安石油大学材料加工工程重点学科资助项目;西安石油大学青年基金资助项目(2005-47)
收稿日期 2008/12/8
修改稿日期 2009/7/16
网络出版日期
作者单位点击查看
备注许天旱(1971-),男,陕西礼泉人,讲师,博士研究生.
引用该论文: XU Tian-han,WANG Dang-hui. Effect of Superheat on Particle Morphology of Atomized Sn3Ag2.8Cu Alloy Powders[J]. Materials for mechancial engineering, 2010, 34(1): 24～27
许天旱,王党会. 过热度对Sn3Ag2.8Cu合金雾化粉体颗粒形貌的影响[J]. 机械工程材料, 2010, 34(1): 24～27
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【4】SHIUE R K,TSAY L W,LIN C L,et al.A study of Sn-Bi-Ag-In lead-free solders[J].Journal of Materials Science,2003,38(6):1269-1279.
【5】KIM Y S,KIM K S,HWANG C W,et al.Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys[J].Journal of Alloys and Compounds,2003,352(1/2):237-245.
【6】LI D Z,LIU C Q,CONWAY P P.Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn-Ag-Cu flip-chip solder interconnects[J].Materials Science and Engineering A,2005,391(1/2):95-103.
【7】YOON J W,KIM S W,JUNG S B.IMC morphology,interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate[J].Journal of Alloys and Compounds,2005,392(1/2):247-252.
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【9】OZBILEN S.Influence of atomization gas in particle characteristics of Al,Al-1wt%Li,Mg and Sn powder[J].Powder Metallurgy,2000,43(2):173-180.
【10】LEE S Y,KIM T S,LEE J K,et al.Effect of powder size on the consolidation of gas atomized Cu54Ni6Zr22Ti18 amorphous powders[J].Intermetallics,2006,14:1000-1004.
【11】赵麦群,赵高扬,于喜良,等.无铅焊锡合金粉末超音速雾化技术的研究[J].粉末冶金技术,2003,21(2):79-81.
【12】ZHAO X Y,ZHAO M Q,CUI X Q,et al.Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys[J].Transactions of Nonferrous Metals Society of China,2007,17:805-810.
【13】许天旱,赵麦群,邸晓波,等.过热度对无铅焊锡雾化粉末特性的影响[J].材料导报,2005,19(4):128-130.
【14】张璟,周哲玮.喷射成形中的喷射雾化机理研究[J].粉末冶金技术,1999,17(3):163-168.
【15】孙剑飞,曹福祥,沈军,等.喷射成形过程中雾化熔滴的凝固行为[J].特种铸造及有色合金,2002,20(3):1-4.
【16】OZBILEN S.Satellite formation mechanism in gas atomised powders[J].Powder Metallurgy,1999,42(1):70-78.
【17】吕海波,母育锋,李新军,等.熔体过热度对雾化过程的影响[J].中南工业大学学报,1997,28(2):149-151.
【18】谈慕华,黄蕴元.表面物理化学[M].北京:中国建筑工业出版社,1982:24.
【19】蔡艳秀,李作光,萨支林.气体雾化法生产快凝铝合金粉及其应用[J].轻合金加工技术,1992,20(2):36-42.
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