铜/钼/铜电子封装材料的轧制复合工艺
Rolling Cladding Technology of Cu/Mo/Cu Electronic Packaging Material
摘 要
采用不同轧制复合工艺制备了铜/钼/铜复合板:利用超声检测仪、万能材料试验机等研究了首道次压下率和退火温度对复合板结合强度及热导率的影响,在此基础上确定了其轧制复合工艺.结果表明:采用首道次压下率为60%、退火温度为700℃、保温时间为60 min的是较理想的工艺,其界面结合强度可达到80 N·mm-1,其厚度方向的热导率为210 W·m-1·K-1.
退火
压下率
铜
钼
electronic packaging material
annealing
pressing ratio
Cu
Mo
Abstract
Cu/Mo/Cu cladding plates were prepared by different rolling cladding technologies.The effects of the first pressing ratio and annealing temperature on bonding strength and thermal conductivity of the cladding plates were analyzed by means of ultrasonic detector and universal testing machine.The rolling cladding technology was obtained.The results indicate that the best process was first pressing ratio 60%,annealing temperature 700℃ and holding time 60 min.The interface bonding strength reached 80 N·mm-1 and thermal conductivity in thickness direction was 210 W·m-1·K-1.
中图分类号 TG335.22
所属栏目 新材料 新工艺
基金项目
收稿日期 2009/2/20
修改稿日期 2009/8/19
网络出版日期
作者单位点击查看
备注程挺宇(1978-),男,江苏常州人,工程师,硕士.
引用该论文: CHENG Ting-yu,XIONG Ning,WU Cheng,QING Si-gui,LING Xian-ye. Rolling Cladding Technology of Cu/Mo/Cu Electronic Packaging Material[J]. Materials for mechancial engineering, 2010, 34(3): 38～40
程挺宇,熊宁,吴诚,秦思贵,凌贤野. 铜/钼/铜电子封装材料的轧制复合工艺[J]. 机械工程材料, 2010, 34(3): 38～40
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参考文献
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【3】张永昌.金属喷射成形的进展[J].粉末冶金工业,2001,11(6):18-20.
【4】PLESCHIUTSCHIGG F P,HAGEN I V,GAMMAL T E,et al.Inversion casting of steel strip[J].Steel Times,1995,223(6):228-229.
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【6】黄强,顾明元,金燕萍.电子封装材料的研究现状[J].材料导报,2000,14(9):28-32.
【7】KACZMAR J W,PIETRZAK K.The production and application of metal matrix composite materials[J].Journal of Materials Processing and Technology,2000,106(1):58-67.
【8】LUBY S,MAJKOVA E,JERGER M,et al.Intermixing in immiscible molybdenum/copper multilayered metallization under excimer laser irradiation[J].Applied Surface Science,1996,106(2):243-246.
【9】PHILIP M F.Reliability of radio frequency/microwave power packages: the effects of component materials and assembly processes[J].Microelectronics and Reliability,1999,39(8):1265-1274.
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