镀液pH值及浓度对铝基表面化学镀镍-磷镀层磷含量及镀速的影响
Effects of pH Value and Concentration of Solution on P Content and Deposition Rate during Electroless Ni-P Plating on Aluminum Substrate Surface
摘 要
通过正交试验对比分析了镀液pH值,主盐、还原剂以及络合剂浓度等因素对铝基表面化学镀镍-磷镀层磷含量及镀速的影响.结果表明:镀液pH值的影响最主要,其次为主盐和还原剂浓度;对于选定成分的酸性(3.5≤pH≤6)镀液,随pH值的增大,镀层磷原子分数由22.5%(pH=3.5)逐渐减至12.6%(pH=6.0),而镀速随pH值的增大而增加,达到最大值21.0 μm·h-1(pH=5.0)后变化不大;镀层磷含量随主盐NiSO4浓度增大而降低,随还原剂NaH2PO2浓度增大而增加,而主盐和还原剂浓度的增大都可增加镀速;最终获得了磷原子分数为15.2%、镀速达到21.0 μm·h-1的镀层.
镍-磷镀层
磷含量
镀速
electroless plating
Ni-P plating
P content
deposition rate
Abstract
The effects of the factors including pH value,concentration of main salt,reductant and complexing agent of the solution on the deposition rate and P content of the electroless Ni-P plating on aluminum substrate surface were investigated by the orthogonal test.The results show that the effect of the solution pH value was the most significant,and it was followed by main salt concentration and reductant concentration.In the selected acid solution,with the increase of pH value in the range of 3.5 to 6.0,the P content in the solution decreased from 225at%(pH=3.5) to 12.6at% (pH=6.0).And the deposition rate increased till the rate reached the maximum value of 21.0 μm·h-1 (pH=5.0),and then it had little change.The P content decreased with the increase of main salt concentration of NiSO4,but increased with the increase of reductant concentration of NaH2PO2.The deposition rate increased with the increase of the concentration of main salt and reductant.An excellent Ni-P plating with 152at% P and deposition rate of 21.0 μm·h-1 could be obtained.
中图分类号 TQ153.2
所属栏目 试验研究
基金项目 “十一五”国家科技支撑计划资助项目(2006BAE03B02-2)
收稿日期 2009/5/23
修改稿日期 2009/11/23
网络出版日期
作者单位点击查看
备注柏冬梅(1982-),女,辽宁沈阳人,硕士研究生.
引用该论文: BAI Dong-mei,HUANG Ming-liang. Effects of pH Value and Concentration of Solution on P Content and Deposition Rate during Electroless Ni-P Plating on Aluminum Substrate Surface[J]. Materials for mechancial engineering, 2010, 34(6): 28～32
柏冬梅,黄明亮. 镀液pH值及浓度对铝基表面化学镀镍-磷镀层磷含量及镀速的影响[J]. 机械工程材料, 2010, 34(6): 28～32
共有人对该论文发表了看法，其中：
人认为该论文很差
人认为该论文较差
人认为该论文一般
人认为该论文较好
人认为该论文很好
参考文献
【1】ALAM M O,CHAN Y C,TU K N.Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad[J].J Appl Phys,2003,94(6):4108-4115.
【2】YOON J W,LEE C B,JUNG S B.Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment[J].J Electron Mater,2003,32(11):1195-1202.
【3】AHMED SHARIF,CHAN Y C.Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni (P) metallization[J].Journal of Alloys and Compounds,2007,440:117-121.
【4】QI G,CHEN X,SHAO Z.Influence of bath chemistry on zincate morphology on aluminum bond pad[J].Thin Solid Films,2002,406:204-209.
【5】ALAM M O,CHAN Y C,HUNG K C.Reliability study of the electroless Ni-P layer against solder alloy[J].Microelectron Reliab,2002,42(7):1065-1073.
【6】SOHN Y C,YU J,KANG S K,et al.Study of spalling behavior of intermetallic compounds during the reaction between electroless Ni-P metallization and lead-free solders[J].J Mater Res,2004,19(8):2428-2436.
【7】KUMAR A,CHEN Z.Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint[J].Materials Science and Engineering A,2006,423:175-179.
【8】LIN Y C,DUH J G.Phase transformation of the phosphorus-rich layer in SnAgCu/Ni-P solder joints[J].Scripta Materialia,2006,54:1661-1665.
【9】YOON J W,JUNG S B.Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate[J].Journal of Alloy and Compounds,2004,376:105-110.
【10】MAYER J W,LAU S S.Electronic materials science:for integrated circuits in Si and GaAs[M].New York:MacMillan,1990.
【11】杨海燕,朱万学.非晶化学镀镍工艺研究与应用[J].腐蚀与防护,2004,25(3):121-123.
【12】万家瑰,李淑华,冯小军.铝基化学镀Ni-P合金工艺研究[J].电镀与精饰,2007,29(5):42-44.
【13】李宁.化学镀实用技术[M].北京:化学工业出版社,2004.
【14】李学伟,赵国刚.Ni-P化学镀高稳定性镀液及优化规律[J].黑龙江科技学院学报,2004,14(11):236-239.
【15】蔡晓兰,黄鑫,贺子凯.化学镀镍磷合金镀速的研究[J].电镀与涂饰,2001,20(12):39-41.
【16】关凯书,梁安波,吕宝君,等.磷含量对镍磷化学镀层结构及表面形貌的影响[J].机械工程材料,2000,24(2):20-22.
【2】YOON J W,LEE C B,JUNG S B.Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment[J].J Electron Mater,2003,32(11):1195-1202.
【3】AHMED SHARIF,CHAN Y C.Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni (P) metallization[J].Journal of Alloys and Compounds,2007,440:117-121.
【4】QI G,CHEN X,SHAO Z.Influence of bath chemistry on zincate morphology on aluminum bond pad[J].Thin Solid Films,2002,406:204-209.
【5】ALAM M O,CHAN Y C,HUNG K C.Reliability study of the electroless Ni-P layer against solder alloy[J].Microelectron Reliab,2002,42(7):1065-1073.
【6】SOHN Y C,YU J,KANG S K,et al.Study of spalling behavior of intermetallic compounds during the reaction between electroless Ni-P metallization and lead-free solders[J].J Mater Res,2004,19(8):2428-2436.
【7】KUMAR A,CHEN Z.Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint[J].Materials Science and Engineering A,2006,423:175-179.
【8】LIN Y C,DUH J G.Phase transformation of the phosphorus-rich layer in SnAgCu/Ni-P solder joints[J].Scripta Materialia,2006,54:1661-1665.
【9】YOON J W,JUNG S B.Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate[J].Journal of Alloy and Compounds,2004,376:105-110.
【10】MAYER J W,LAU S S.Electronic materials science:for integrated circuits in Si and GaAs[M].New York:MacMillan,1990.
【11】杨海燕,朱万学.非晶化学镀镍工艺研究与应用[J].腐蚀与防护,2004,25(3):121-123.
【12】万家瑰,李淑华,冯小军.铝基化学镀Ni-P合金工艺研究[J].电镀与精饰,2007,29(5):42-44.
【13】李宁.化学镀实用技术[M].北京:化学工业出版社,2004.
【14】李学伟,赵国刚.Ni-P化学镀高稳定性镀液及优化规律[J].黑龙江科技学院学报,2004,14(11):236-239.
【15】蔡晓兰,黄鑫,贺子凯.化学镀镍磷合金镀速的研究[J].电镀与涂饰,2001,20(12):39-41.
【16】关凯书,梁安波,吕宝君,等.磷含量对镍磷化学镀层结构及表面形貌的影响[J].机械工程材料,2000,24(2):20-22.
相关信息
