采用数字图像相关法成功得到了芯片焊点(尺寸为 0.8 mm)在均匀热载荷下的面内位移变形场的数字化结果。检测系统结合了长距离显微观测及图像采集系统、可控制加热恒温系统及照明系统等硬件，使数字图像相关测试进入到细观研究领域。在进行芯片焊点表面位移场的定量测量的同时，利用相同边界条件的有限元方法进行模拟计算，以进行结果的比较，两者吻合较好。试验结果证明了数字图像相关方法及设计的检测系统在微变形场测量上的准确性和稳定性。

The digital result of surface displacement deformation field under uniform thermal load of chip solder joint (no more than  0.8 mm) was successfully got by digital image correlation method. The system combined the long distance microscopic observation and image acquisition system, thermostats controllable heating and lighting systems and other hardwares, and it made the digital image correlation method possible to proceed research in micro field. At the same time, finite element method was simulated with the same boundary conditions and the caculated results showed that datas obtained by the two methods were in good agreement. Testing results showed that the digital image correlation method and the designed testing system was in good accuracy and stability in micro deformation measurement.