一种研究Cu/Al界面原子扩散Kirkendall效应的新方法
A NEW METHOD OF INVESTIGATING THE KIRKENDALL EFFECT OF ATOMIC DIFFUSION AT Cu/Al INTERFACE
摘 要
利用铆钉法制备了Cu-Al扩散偶。借助光学显微镜和彩色金相技术，通过分析烧结过程中销钉及销孔直径尺寸的变化，研究了Cu/Al界面原子扩散的Kirkandall效应。结果表明，在烧结温度范围内铜向铝中的扩散强度大于铝向铜中的扩散强度。
Cu-Al扩散偶
Kirkendall效应
Mechanical method
Cu-Al diffusion couple
Kirkendall effect
Abstract
Cu-Al diffusion couples were prepared with mechanical method. The Kirkendall effect of atomic diffusion at Cu/Al interface was investigated by analyzing the changes of the diameters of pin and pinhole respectively during sintering with the help of the OPM and color metallograph. The results show that Cu diffused more into Al in the range of the sintering temperature.
中图分类号 TG111.6
所属栏目
基金项目 国家自然科学基金-相界扩散溶解的TFDC模型(50371059)
收稿日期 2005/12/28
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备注耿相英(1981-)，男，硕士。
引用该论文: GENG Xiang-ying,LI Shi-chun. A NEW METHOD OF INVESTIGATING THE KIRKENDALL EFFECT OF ATOMIC DIFFUSION AT Cu/Al INTERFACE[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2006, 42(6): 292～294
耿相英,李世春. 一种研究Cu/Al界面原子扩散Kirkendall效应的新方法[J]. 理化检验－物理分册, 2006, 42(6): 292～294
被引情况:
【1】杨泽亮,宋玉强,李世春, "Co-Zn扩散偶的界面迁移",理化检验－物理分册 43, 59-61(2007)
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参考文献
【1】李亚江,吴会强,陈茂爱,等.Cu/ Al真空扩散焊接头显微组织分析[J].中国有色金属学报, 2001,11(3):424-427.
【2】Lee Won-Bae, Bang Kuek-Saeng, Jung Seung-Boo. Effects of Intermetallic Compound on the Electrical andMechanical Properties of Friction Welded Cu/Al Bimetallic Joints During Annealing[J]. Journal of Alloys and Compounds, 2005,390:212-219.
【3】张玉林,刘家明.热轧复合Cu-Al太阳能复合材料的界面分析[J].云南冶金, 1995,(2):44-45.
【4】Abbasi M, Karimi Taheri A, Saleh M T. Growth Rate of Intermetallic Compounds in Al/Cu Bimetal Produced by Cold Roll Welding Process[J]. Journal of Alloys and Compounds, 2001,319:233-241.
【5】Harutyunyan V S, Torossyan A R, Aivazyan A P. Deformations Subgrain Structure, Dislocation Arrangement and Transition Layer Formation in Cu/Al Coating Deposited by Mechanochemical Technique[J]. Applied Surface Science, 2004,222:43-64.
【6】Paul A. Bifurcation of the Kirkendall Plane During Interdiffusion in the Intermetallic Compound β-NiAl[J]. Acta Materialia, 2004,52:4041-4048.
【7】Ryusuke Nakamura, Kohtaro Fujita, Yoshiaki Iijima, et al. Diffusion Mechanisms in B2 NiAl Phase Studied by Experiments on Kirkendall Effect and Interdiffusion Under High Pressures[J]. Acta Materialia, 2003,51:3861-387.
【8】美国金属学会编.金属手册[M].北京:机械工业出版社, 1979.
【9】励志峰,张新明,陈健美,等.铜/钢爆炸焊接板浸铝铸件中铝/钢界面裂纹的形成与扩展[J].中国有色金属学报, 2004,14(2):223-227.
【10】潘金生,仝健民.材料科学基础[M].北京:清华大学出版社, 1998.
【11】韩 彬,李世春,邹增大.热压法获得Zn-Al共析组织的研究[J].机械工程材料, 2002,26(9):7-9.
【2】Lee Won-Bae, Bang Kuek-Saeng, Jung Seung-Boo. Effects of Intermetallic Compound on the Electrical andMechanical Properties of Friction Welded Cu/Al Bimetallic Joints During Annealing[J]. Journal of Alloys and Compounds, 2005,390:212-219.
【3】张玉林,刘家明.热轧复合Cu-Al太阳能复合材料的界面分析[J].云南冶金, 1995,(2):44-45.
【4】Abbasi M, Karimi Taheri A, Saleh M T. Growth Rate of Intermetallic Compounds in Al/Cu Bimetal Produced by Cold Roll Welding Process[J]. Journal of Alloys and Compounds, 2001,319:233-241.
【5】Harutyunyan V S, Torossyan A R, Aivazyan A P. Deformations Subgrain Structure, Dislocation Arrangement and Transition Layer Formation in Cu/Al Coating Deposited by Mechanochemical Technique[J]. Applied Surface Science, 2004,222:43-64.
【6】Paul A. Bifurcation of the Kirkendall Plane During Interdiffusion in the Intermetallic Compound β-NiAl[J]. Acta Materialia, 2004,52:4041-4048.
【7】Ryusuke Nakamura, Kohtaro Fujita, Yoshiaki Iijima, et al. Diffusion Mechanisms in B2 NiAl Phase Studied by Experiments on Kirkendall Effect and Interdiffusion Under High Pressures[J]. Acta Materialia, 2003,51:3861-387.
【8】美国金属学会编.金属手册[M].北京:机械工业出版社, 1979.
【9】励志峰,张新明,陈健美,等.铜/钢爆炸焊接板浸铝铸件中铝/钢界面裂纹的形成与扩展[J].中国有色金属学报, 2004,14(2):223-227.
【10】潘金生,仝健民.材料科学基础[M].北京:清华大学出版社, 1998.
【11】韩 彬,李世春,邹增大.热压法获得Zn-Al共析组织的研究[J].机械工程材料, 2002,26(9):7-9.
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