Sn-Ag-Cu系无铅焊料的显微组织与性能
MICROSTRUCTURES AND PROPERTIES OF Pb-FREE SOLDER Sn-Ag-Cu SYSTEM ALLOY
摘 要
用无铅焊料取代现有的含铅焊料已经成为历史发展的必然趋势。Sn-Ag-Cu系合金具有优异的可靠性和可焊性,受到了电子工业界的广泛关注。阐述了近年来该系焊料合金的微观组织和性能的一些研究成果,并对该系无铅焊料的特性进行了比较。结果表明,低银焊料的组织和性能比高银焊料好,而且成本低,为确定综合性能最佳的该系焊料合金提供依据。
微观组织
性能
Pb-free solder
Microstructure
Property
Abstract
Lead-containing solders have been used in attaching components and printed circuit boards (PCBs) in electronics industry due to their unique characteristics of excellent economical efficiency,practicability and reliability that are well suited for electronics applications. However,over lead ending up in landfill would contaminate land and water supplies,and over lead would resist recycling operations,it is inevitable that lead-containing solders must be replaced by lead free solder. The electronics industry begins to focus upon the tin-silver-copper system alloys as they have the advantages of good reliability and good solderability. A review of the research development of microstructures and properties of tin-silver-copper system alloys in recent years is made. It shows no advantages in terms of processing,reliability,or availability for the high-silver alloys as compared to the low-silver alloys. The result could provide the basis for selecting the optimal solder alloy in this system.
中图分类号 TG146.1+4
所属栏目 试验与研究
基金项目 福建省科技专项经费(2005F5009)
收稿日期 2006/12/6
修改稿日期
网络出版日期
作者单位点击查看
备注刘艳斌(1947-),男,教授,博士生导师。
引用该论文: LIU Yan-bing,WU Ben-sheng,YANG Xiao-hua. MICROSTRUCTURES AND PROPERTIES OF Pb-FREE SOLDER Sn-Ag-Cu SYSTEM ALLOY[J]. Physical Testing and Chemical Analysis part A:Physical Testing, 2007, 43(6): 279～281
刘艳斌,吴本生,杨晓华. Sn-Ag-Cu系无铅焊料的显微组织与性能[J]. 理化检验－物理分册, 2007, 43(6): 279～281
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参考文献
【1】Hwang J S. Lead free solder: the Sn/Ag/Cu system［J］. SMT Magazine,2000,6:18-21．
【2】Zeng K,Tu K N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology［J］. Materials Science and Engineering Reports,2002,38(2):55-105．
【3】沈 俊,刘永长.,张培珍,等.无铅焊料研究现状与发展展望［J］.功能材料,2004,35(4):403-406．
【4】Anderson I E,Cook B A,Harringa J,et al. Sn-Ag-Cu solders and solder joints: alloy development,microstructure,and properties［J］. J Electron Mater,2002,31(11):1166-1174．
【5】National Physical Laboratory (NPL,UK),http://www.npl.co.uk/npl/ei/eig/leadfree/properties.pdf.html．
【6】Sohn,John E. Are Lead-Free Solder Joints Reliable［J］. Circuits Assembly,2002,13(6):32-35．
【7】Kanchanomai C,Miyashita Y,Mutohat Y. Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder［J］. Soldering and Surface Mount Technology,2002,14(3):30-36．
【8】Sharif Ahmed,Islam M N,Chan Y C. Interfacial reactions of BGA Sn–3.5%Ag–0.5%Cu and Sn–3.5% Agsolders during high-temperature aging with Ni/Cu metallization［J］. Materials Science and Engineering,2004,B113(2):184-189．
【9】Li G Y,Chen B L. Formation and Growth Kinetics of Interfacial Intermetallics in Pb-Free Solder Joint［J］. IEEE Transactions On Components And Packaging Technologies,2003,26(3):651-658．
【10】Kim K S,Huh S H,Suganuma K. Effects of Cooling Speed on Microstructure and Tensile Properties of Sn-Ag-Cu Alloys［J］. Materials Science and Engineering A,2002,333(1):106-114．
【11】Kim K S,Huh S H,Suganuma K. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered［J］. Journal of Alloys and Compounds,2003,352(1):226-236．
【12】Kang Sung K,Shih Da-Yuan,Henderson Donald W et al. Ag3Sn Plate Formation in the Solidification of Near TernaryEutectic Sn-Ag-Cu Alloys［J］. Journal of the Minerals Metals and Materials Society,2003,55(6):61-65．
【2】Zeng K,Tu K N. Six cases of reliability study of Pb-free solder joints in electronic packaging technology［J］. Materials Science and Engineering Reports,2002,38(2):55-105．
【3】沈 俊,刘永长.,张培珍,等.无铅焊料研究现状与发展展望［J］.功能材料,2004,35(4):403-406．
【4】Anderson I E,Cook B A,Harringa J,et al. Sn-Ag-Cu solders and solder joints: alloy development,microstructure,and properties［J］. J Electron Mater,2002,31(11):1166-1174．
【5】National Physical Laboratory (NPL,UK),http://www.npl.co.uk/npl/ei/eig/leadfree/properties.pdf.html．
【6】Sohn,John E. Are Lead-Free Solder Joints Reliable［J］. Circuits Assembly,2002,13(6):32-35．
【7】Kanchanomai C,Miyashita Y,Mutohat Y. Low cycle fatigue and fatigue crack growth behaviour of Sn–Ag eutectic solder［J］. Soldering and Surface Mount Technology,2002,14(3):30-36．
【8】Sharif Ahmed,Islam M N,Chan Y C. Interfacial reactions of BGA Sn–3.5%Ag–0.5%Cu and Sn–3.5% Agsolders during high-temperature aging with Ni/Cu metallization［J］. Materials Science and Engineering,2004,B113(2):184-189．
【9】Li G Y,Chen B L. Formation and Growth Kinetics of Interfacial Intermetallics in Pb-Free Solder Joint［J］. IEEE Transactions On Components And Packaging Technologies,2003,26(3):651-658．
【10】Kim K S,Huh S H,Suganuma K. Effects of Cooling Speed on Microstructure and Tensile Properties of Sn-Ag-Cu Alloys［J］. Materials Science and Engineering A,2002,333(1):106-114．
【11】Kim K S,Huh S H,Suganuma K. Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered［J］. Journal of Alloys and Compounds,2003,352(1):226-236．
【12】Kang Sung K,Shih Da-Yuan,Henderson Donald W et al. Ag3Sn Plate Formation in the Solidification of Near TernaryEutectic Sn-Ag-Cu Alloys［J］. Journal of the Minerals Metals and Materials Society,2003,55(6):61-65．
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