介绍了电子背散射技术（EBSD）在材料织构方面的研究应用状况,并采用EBSD研究了纯铜在冷轧过程中晶粒的变化、晶粒取向及晶界角度分布的特征。结果表明,纯铜在经过大变形量后出现轧制织构,其轧制织构主要是{112}〈111〉和{011}〈112〉织构;在中小变形量下,随着变形量的增加大角度晶界逐渐减少,而到高变形量时逐渐增加。

The application of EBSD (electron back-scatter diffrantion) is reviewed in materials microtexture study. Microtexture,boundary angle distribution and orientations in high purity copper cold rolled up to 96% （thickness reduction） were investigated. It was found that some special microtexture came forth in the pure copper after cold rolled and the mainly texture were {112}〈111〉and{110}〈112〉. And the area fractions of boundary high angle were decreasing with the increase of deformation at low strain ,while,increased at high strain with increasing cold rolling reduction.