通过正交试验和极差分析研究了各工艺参数对镀层与基体间的结合力影响程度, 通过单因素试验研究了各工艺参数对结合力的影响规律, 并获得了最佳工艺参数。结果表明, 最佳工艺参数为阴极电流密度3 A/dm2,甲基磺酸体积浓度45 mL/L,添加剂体积浓度45 mL/L,Sn2+质量浓度15 g/L,电镀温度35 ℃。

The extents of different parameters′ impact on cohesion between coating and substrate were examined by orthogonal experiments and range analysis. The relationship between each parameter and cohesion was studied by single factor experiments and the optimum technological parameters were obtained. The results show that the optimum technological parameters were as follows: cathodic current density 3 A/dm2, bulk concentration of methanesulfonate 45 mL/L, bulk concentration of additive 45 mL/L, mass concentration of Sn2+ 15 g/L and electroplating temperature 35 ℃.