A Process of Four-Element Immersion Zinc and Direct Copper Plating for Cast Aluminum Alloys
摘 要
针对铸造铝合金的成分和性能特点,设计了四元浸锌工艺,用于铸造铝合金的镀前处理。采用加热试验法检测镀层的附着力;使用扫描电镜和X射线衍射仪对镀层的表面形貌和相结构进行了分析。结果表明: 随着浸锌时间的延长,四元浸锌层越来越致密,浸锌60~90 s可满足铸造铝合金镀前处理要求;经过四元浸锌处理后的镀铜层具有较好的附着力;XRD分析显示镀铜层为多晶结构;焦磷酸盐镀铜层表面比较粗糙,存在较多孔隙;进行硫酸盐镀铜处理后,表面更为平整,针孔缺陷得到有效抑制。
Abstract
According to the chemical composition and properties of cast aluminum alloys, four-element immersion zinc process was designed and used as the pretreatment for copper electroplating. Heating method was employed to measure the adhesion property of electroplating coating. SEM and XRD were applied to analyze the coating morphology and phase structure. The results show that with the increase of immersion zinc time, the density of zinc coating increased. The optimal time of immersion zinc was 60~90 s. The pretreatment process of four-element immersion zinc can enhance the adhesion of electroplating coating. The XRD result indicated that the copper electroplating coating was crystal structure. The pyrophosphate copper plating coating had a coarse surface and many pinholes. After sulfate copper plating, the coating surface became smooth, and pinhole defect was controlled efficiently.
中图分类号 TG174.44 DOI 10.11973/fsyfh-201602012
所属栏目 应用技术
基金项目 广东省自然科学基金(2014A030313784); 江门市科技计划(2014-2015)
收稿日期 2015/2/5
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备注黄元盛(1969-),教授,博士,从事材料表面处理研究,
引用该论文: HUANG Yuan-sheng. A Process of Four-Element Immersion Zinc and Direct Copper Plating for Cast Aluminum Alloys[J]. Corrosion & Protection, 2016, 37(2): 144
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参考文献
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【2】KELLER F,ZELLEY W G. Conditioning aluminum alloysfor electroplating[J]. Journal of the Electrochemical Society,1950,97(4):143-149.
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【6】李贤成. 铸铝件电镀光亮镍[J]. 电镀与环保,2010,30(4):46-47.
【2】KELLER F,ZELLEY W G. Conditioning aluminum alloysfor electroplating[J]. Journal of the Electrochemical Society,1950,97(4):143-149.
【3】黄晓梅,李宁,蒋丽敏,等. 铝及其合金浸锌技术的发展及现状[J]. 电镀与精饰,2006,28(3): 22-26.
【4】蔡婷婷,王兆文. 铝及铝合金电镀研究进展[J]. 有色矿冶,2013,29(6):35-41.
【5】曾领才,文伟,谢辉. 铝及铝合金电镀前处理工艺的改进[J]. 电镀与涂饰,2012,31(3):15-17.
【6】李贤成. 铸铝件电镀光亮镍[J]. 电镀与环保,2010,30(4):46-47.
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