Effect of Electroplated Current Density on Voids at Sn/Electroplated Cu Joint Interface
摘 要
在电流密度分别为1.7,50 mA·cm-2下电镀制备了两种电镀铜基板,将其与锡粒回流焊接成锡/铜接头,并在150℃老化不同时间(10,20 d),观察了电镀铜基板表面和锡/铜接头界面的形貌,分析了柯肯达尔空洞在老化过程中的演变机制。结果表明:经老化处理后,两种锡/铜接头均在Cu3Sn/Cu界面形成空洞,空洞的密度随着老化时间的延长逐渐增大,高电流密度下的空洞密度也大;使用较高电流密度制备电镀铜基板的接头,未经老化处理其界面已出现空洞,经老化处理后,空洞逐渐聚集成为空腔,空腔内表面成为铜元素的快速扩散通道;电流密度会影响表面电镀层的组织结构,从而影响后续老化过程中界面的组织结构。
Abstract
Two electroplated Cu substrates were prepared at current densities of 1.7 mA ·cm-2 and 50 mA ·cm-2. Then by reflow soldering the electroplated Cu substrates and Sn granular, the Sn/Cu joints were obtained and aged at 150℃ for different times (10, 20 d). The surface morphology of the electroplated Cu substrates and interface morphology of the Sn/Cu joints were observed and the evolution mechanism of Kirkendall voids during aging was also analyzed. The results show that after the aging treatment, the voids were formed at Cu3Sn/Cu interface of the two Sn/Cu joints and the density of voids increased gradually with the expansion of aging time and was relatively high at a relatively high current density. Before aging treatment, the voids appeared at the interface of the joint with the electroplated Cu substrate prepared at a relatively high current density; after aging treatment, the voids aggregated gradually and then changed into cavities. The inner surface of cavities became the channels for the rapid diffusion of Cu. The microstructure of the surface electroplate layer was influenced by the current density, which in turn influenced the interfacial microstructure in the following aging process.
中图分类号 TG146.23 DOI 10.11973/jxgccl201706003
所属栏目 试验研究
基金项目 国家自然科学基金资助项目(51105251)
收稿日期 2016/4/11
修改稿日期 2017/5/4
网络出版日期
作者单位点击查看
备注杨扬(1982-),男,山西侯马人,博士
引用该论文: YANG Yang,YU Chun. Effect of Electroplated Current Density on Voids at Sn/Electroplated Cu Joint Interface[J]. Materials for mechancial engineering, 2017, 41(6): 10~13
杨扬,余春. 电镀电流密度对锡/电镀铜接头界面空洞的影响[J]. 机械工程材料, 2017, 41(6): 10~13
共有人对该论文发表了看法,其中:
人认为该论文很差
人认为该论文较差
人认为该论文一般
人认为该论文较好
人认为该论文很好
参考文献
【1】ZENG K, STIERMAN R, CHIU T C, et al. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability[J]. Journal of Applied Physics, 2005, 97(2):024508.
【2】XU L, PANG J, CHE F. Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level reliability[J]. Journal of Electronic Materials, 2008, 37(6):880-886.
【3】郭洪强. 63Sn-37Pb和Sn-3Ag-0.5Cu合金钎料的扭转低周疲劳性能[J]. 机械工程材料, 2014,38(8):65-69.
【4】YANG W, MESSLER R W, FELTON L E. Microstructure evolution of eutectic Sn-Ag solder joints[J]. Journal of Electronic Materials, 1994, 23(8):765-772.
【5】KIM S H, YU J. Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation[J]. Scripta Materialia, 2013, 69(3):254-257.
【6】WAFULA F, LIU Y, YIN L, et al. Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell[J]. Journal of Applied Electrochemistry, 2011, 41(4):469-480.
【7】YIN L, BORGESEN P. On the root cause of Kirkendall voiding in Cu3Sn[J]. Journal of Materials Research, 2011, 26(3):455-466.
【8】YIN L, WAFULA F, DIMITROV N, et al. Toward a better understanding of the effect of Cu electroplating process parameters on Cu3Sn voiding[J]. Journal of Electronic Materials, 2012, 41(2):302-312.
【9】LI H, AN R, WANG C, et al. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing[J]. Materials Letters, 2015, 158:252-254.
【10】LI H, AN R, WANG C, et al. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints[J]. Materials Letters, 2015, 144:97-99.
【11】杨扬. Sn基钎料/Cu界面柯肯达尔空洞机理研究[D]. 上海:上海交通大学, 2012.
【12】LIU T C, LIU C M, HUANG Y S, et al. Eliminate Kirkendall voids in solder reactions on nanotwinned copper[J]. Scripta Materialia, 2013, 68(5):241-244.
【2】XU L, PANG J, CHE F. Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level reliability[J]. Journal of Electronic Materials, 2008, 37(6):880-886.
【3】郭洪强. 63Sn-37Pb和Sn-3Ag-0.5Cu合金钎料的扭转低周疲劳性能[J]. 机械工程材料, 2014,38(8):65-69.
【4】YANG W, MESSLER R W, FELTON L E. Microstructure evolution of eutectic Sn-Ag solder joints[J]. Journal of Electronic Materials, 1994, 23(8):765-772.
【5】KIM S H, YU J. Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation[J]. Scripta Materialia, 2013, 69(3):254-257.
【6】WAFULA F, LIU Y, YIN L, et al. Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell[J]. Journal of Applied Electrochemistry, 2011, 41(4):469-480.
【7】YIN L, BORGESEN P. On the root cause of Kirkendall voiding in Cu3Sn[J]. Journal of Materials Research, 2011, 26(3):455-466.
【8】YIN L, WAFULA F, DIMITROV N, et al. Toward a better understanding of the effect of Cu electroplating process parameters on Cu3Sn voiding[J]. Journal of Electronic Materials, 2012, 41(2):302-312.
【9】LI H, AN R, WANG C, et al. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing[J]. Materials Letters, 2015, 158:252-254.
【10】LI H, AN R, WANG C, et al. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints[J]. Materials Letters, 2015, 144:97-99.
【11】杨扬. Sn基钎料/Cu界面柯肯达尔空洞机理研究[D]. 上海:上海交通大学, 2012.
【12】LIU T C, LIU C M, HUANG Y S, et al. Eliminate Kirkendall voids in solder reactions on nanotwinned copper[J]. Scripta Materialia, 2013, 68(5):241-244.
相关信息