Microstructure and Properties of Incoloy825 Alloy after Solution at Different Temperatures
摘 要
采用扫描电子显微镜、透射电子显微镜、布氏硬度计、拉伸试验机等设备对不同温度固溶后Incoloy825合金的显微组织、力学性能及耐腐蚀性能等进行了研究。结果表明:当固溶温度在980~1 050 ℃之间时,合金的晶粒尺寸变化不明显,当固溶温度高于1 050 ℃时,晶粒尺寸以较快的速率增大;随着固溶温度的升高,合金的硬度和抗拉强度逐渐降低,伸长率不断增大;晶界析出相主要是由富含铬、钼的M23C6碳化物和含铬、镍、铁、钼的金属间化合物组成,晶界析出相的数量随着固溶温度的升高呈现先增多后减少的趋势,固溶温度为1 015 ℃时晶界析出相最多,此时合金的耐晶间腐蚀性能最差。
Abstract
The microstructure, mechanical properties and corrosion resistance of Incoloy825 alloy after solution at different temperatures were researched by scanning electron microscope, transmission electron microscope, brinell hardness tester, tensile test machine. The results show that the grain size did not change after solution at 980-1 050℃, but grain size obviously increased when solution temperature was above 1 050℃. The hardness and tensile strength decreased but the elongation increased with the increase of solution temperature. The precipitate phase along grain boundary consisted of M23C6 carbide with Cr and Mo and intermetallic compound with Cr, Ni, Fe and Mo. The amount of precipitate phase increased initially and decreased afterwards with the increase of solution temperature. When solution temperature was 1 015℃, the amount of precipitate phase reached to the maximum, while the intergranular corrosion resistance was the worst.
中图分类号 TG161 DOI 10.11973/jxgccl201708005
所属栏目 试验研究
基金项目
收稿日期 2016/5/6
修改稿日期 2017/6/6
网络出版日期
作者单位点击查看
备注洪慧敏(1987-),女,江苏盐城人,助理工程师,硕士
引用该论文: HONG Huimin,ZHANG Ke,JIN Chuanwei,HU Xianjun. Microstructure and Properties of Incoloy825 Alloy after Solution at Different Temperatures[J]. Materials for mechancial engineering, 2017, 41(8): 23~26
洪慧敏,张珂,金传伟,胡显军. 不同温度固溶后Incoloy825合金的显微组织与性能[J]. 机械工程材料, 2017, 41(8): 23~26
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参考文献
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