球化介质对球栅阵列封装钎焊球质量的影响
Effect of Spheroidizing Medium on Quality of Ball Grid Array Solder Ball
摘 要
以63Sn37Pb焊丝为原料，分别以花生油、硅油、机油、蓖麻油为球化介质，利用切丝重熔法在球化温度为320℃下制备了球栅阵列封装（BGA）焊球，研究了不同球化介质对焊球真球度、表面质量及含氧量的影响。结果表明：当球化介质为花生油时，焊球的真球度最高，为98.89%，表面质量最好，且含氧量最低，为0.027%（质量分数）；花生油的球化效果最好，蓖麻油次之，硅油和机油的最差。
BGA焊球
真球度
表面质量
含氧量
spheroidizing medium
BGA solder ball
real sphericity
surface quality
oxygen content
Abstract
With 63Sn37Pb welding wire as raw material, using peanut oil, silicone oil, engine oil and castor oil as spheroidizing mediums, respectively, ball grid array (BGA) solder balls were prepared by the cutting-remelting technology at spheroidization temperature of 320℃. The effects of different spheroidizing mediums on the real sphericity, surface quality and oxygen content of the solder balls were studied. The results show that when the spheroidizing medium was peanut oil, the prepared solder balls had the highest real sphericity of 98.89% and the best surface quality, and also the oxygen mass fraction was the lowest of 0.027%. The peanut oil had the best spheroidization effect, followed by the castor oil, while the spheroidization effects of the silicone oil and the engine oil were the worst.
中图分类号 TG454 DOI 10.11973/jxgccl201710007
所属栏目 新材料 新工艺
基金项目 河南省杰出青年基金资助项目（144100510002）
收稿日期 2016/8/20
修改稿日期 2017/9/4
网络出版日期
作者单位点击查看
备注李涛(1990-),男,河南南阳人,硕士研究生
引用该论文: LI Tao,YAN Yanfu,WANG Guangxin,GAO Shijun. Effect of Spheroidizing Medium on Quality of Ball Grid Array Solder Ball[J]. Materials for mechancial engineering, 2017, 41(10): 28～32
李涛,闫焉服,王广欣,高世军. 球化介质对球栅阵列封装钎焊球质量的影响[J]. 机械工程材料, 2017, 41(10): 28～32
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