为了改善电镀厚铬层气密性差的现状，采用工厂现行的电镀工艺在基体表面制备不同厚度的铬层，研究了不同厚度铬层的表面内应力、硬度、晶粒大小和织构。结果表明：随着厚度的增加，铬层表面内应力呈波动性变化，且表面内应力均为拉应力；随着厚度的增加，铬层中的大尺寸晶粒增多，但平均晶粒尺寸变化不大，均为8.5 μm左右；随着铬层厚度的增加，（110）晶面织构逐渐退化，（200）晶面织构逐渐增强；随着铬层厚度的增加，铬层硬度先缓慢增大，当铬层厚度由22.51 μm增加到46.02 μm时则迅速增大，随后又缓慢增大。

In order to improve air tightness of the electroplated thick chromium layer, chromium layers with different thicknesses were prepared on the surface of substrate by the actual electroplating process in the factory. The surface internal stress, hardness, grain size and texture of the chromium layers with different thicknesses were studied. The results show that with the increase of the thickness, the surface internal stress of the chromium layer fluctuated. The surface internal stress was tensile stress. With the increase of the thickness, the larger grains in the chromium layer increased, but the average grain size changed little and was about 8.5 μm. With the increase of the thickness, (110) crystal surface texture gradually degraded, (200) crystal surface texture was enhanced gradually. With the increase of the thickness, the hardness of the chromium layer increased slowly and then rapidly when the thickness increased from 22.51 μm to 46.02 μm, and then increased slowly.