通过改变镀液中Sn²⁺、Ag⁺和Cu²⁺浓度，对Cu-6Zn合金进行了表面电镀处理，研究了镀液中离子浓度对表面镀层外观等级和表面形貌的影响，并将采用最优电镀液制得的镀层与常用的63Sn-37Pb镀层进行了对比。结果表明：Sn²⁺浓度为0.20 mmol/L，Ag⁺浓度为5 mmol/L，Cu²⁺浓度为1.5 mmol/L是Cu-6Zn合金电镀液的最佳浓度配比，此时合金外观评价等级为10级，镀层致密、平整，结晶细小；优化得到的Sn-Ag-Cu镀层的耐蚀性略优于63Sn-37Pb镀层的。

Surface electroplating of Cu-6Zn alloy was carried out by changing the concentrations of Sn²⁺, Ag⁺ and Cu²⁺ in the plating solution. The effect of ion concentration in the plating solution on the appearance grade and surface morphology of the surface coating was studied, and the coating prepared by the optimal plating solution was compared with common 63Sn-37Pb coating. The results show that the concentration of Sn²⁺ was 0.20 mmol/L, the concentration of Ag⁺ was 5 mmol/L and the concentration of Cu²⁺ was 1.5 mmol/L, which was the optimum concentration ratio of Cu-6Zn alloy plating solution. Under these conditions, the appearance evaluation level of the alloy was 10, the coating was dense, flat and the crystal was fine; the optimized Sn-Ag-Cu coating had slightly better corrosion resistance than that of 63Sn-37Pb coating.