采用电沉积方法在镁合金表面制备了镍钨合金镀层。通过扫描电子显微镜（SEM）、X射线衍射仪（XRD）、硬度测试和电化学试验等方法研究了钨酸钠含量和电流密度对镀层微观组织以及性能的影响。结果表明：当电流密度一定时，随着钨酸钠含量的增加，镀层的硬度提高，但其孔隙率增加，耐蚀性下降；而当钨酸钠含量一定时，随着电流密度的增加，镀层的硬度提高，点蚀电位增大，耐蚀性略有提高；电流密度为2 A/dm²、钨酸钠质量浓度为10 g/L时，制备的镀层同时具有较高的硬度和较好的耐蚀性。

Ni-W alloy coatings were prepared on the surface of magnesium alloy using electroplating method. The effects of Na₂WO₄ concentration and current density during the electroplating process on the microstructure and properties of the coatings were studied respectively, through electron scanning microscopy (SEM), X-ray diffraction (XRD), hardness testing and electrochemical testing. The results show that when the current density was constant, with the increase of sodium tungstate concentration, the hardness and porosity increased, but the corrosion resistance decreased for the coating. At the same sodium tungstate concentration, the hardness and pitting potential increased with the increase of current density, while the corrosion resistance changed slightly for the coating. When the current density was 2 A/dm² and the concentration of sodium tungstate was 10 g/L, the prepared coating had high hardness and high corrosion resistance.