对碳纳米管（CNTs）依次进行纯化、敏化和活化预处理，再在不同pH （7~13）镀液中，以NaBH₄为还原剂进行化学镀铜，研究了不同阶段处理后CNTs的微观形貌和化学成分，分析了镀液pH对镀铜效果的影响。结果表明：纯化处理后，CNTs表面杂质颗粒消失，物相为纯CNTs；敏化处理后，CNTs表面形成了由连续颗粒组成的敏化层，这些颗粒主要为Sn （OH）₂、Sn （OH） Cl和SnO粒子；活化处理后，活化层由连续、相对细小的颗粒组成，这些颗粒主要为钯和SnO粒子；随着镀液pH的增大，NaBH₄的还原能力增强，CNTs表面铜颗粒增多，当pH为11时，形成了连续均匀的铜镀层，但当pH增大到13后，CNTs表面形成了不连续且尺寸较大的铜颗粒。

Carbon nanotubes (CNTs) were pretreated by purification, sensitization and activation in turn, and then electroless copper plated in plating solution at different pH values (7-13) with NaBH₄ as reductant. Micromorphology and chemical composition of the CNTs treated at different stages were studied, and influence of plating solution pH value on copper plating effect was analyzed. The results show that after purification treatment, the impurity particles on the surface of CNTs disappeared, and the phase was pure CNTs. After sensitization treatement, a sensitized layer composed of continuous particles was formed on the surface of CNTs. These particles were mainly Sn(OH)₂, Sn(OH)Cl and SnO particles. After activation treatment, the activation layer consisted of continuous and relatively fine particles, and these particles were mainly palladium and SnO particles. With increasing pH value of the plating solution, the reducing ability of NaBH₄ increased, so the amount of copper particles on the surface of CNTs increased. When the pH value reached 11, a continuous uniform copper plating was formed. But when the pH value increased to 13, discontinuous copper particles with relatively large size were formed on the surface of CNTs.