当导体表面或内部存在应力集中区域时，该区域的材料参数如电导率、热导率等会发生相应改变。电导率及热导率是涡流热成像（ECT）检测过程中感应加热与热传导阶段的重要影响因素。在获得电导率和热导率等参数对ECT检测结果影响规律的前提下，可以通过ECT检测导体材料的应力状态。在COMSOL MULTIPHYSICS多物理仿真平台上采用数值仿真分析的方法，研究了导体材料的电导率、热导率大小及应力层厚度对被测试件表面温度的影响规律，获得了应力值与温度变化的映射关系。结果表明：在一定范围内，导体应力值、应力层厚度与其表面温度均近似为线性关系。导体拉应力值及应力层厚度越大，应力层的温度越高；压应力值及应力层厚度越大，应力层的温度越低。仿真结果可为后续开展涡流热成像定量检测导体材料的应力提供理论参考。

Stress concentration area on the surface or inside the conductivity material will change its electromagnetic and heat transfer parameters accordingly, such as the electrical conductivity, thermal conductivity and so on. The electrical conductivity and thermal conductivity play important role in the process of induction heating and heat propagation process of eddy current thermography (ECT) testing. If the influence of electrical conductivity and thermal conductivity on the testing result of ECT is known, the stress state of conductor material can be measured with ECT by extracting features of the temperature distribution or temperature rise from the IR images or image sequence. In this paper, the effects of electrical conductivity, thermal conductivity and stress layer thickness on the surface temperature of the specimen were investigated by the means of numerical simulation with COMSOL MULTIPHYSICS. The relationship between stress value, stress layer thickness and temperature variation was presented. The results show that the relationship between the stress and its thickness of the specimen and its surface temperature is approximately linear in a certain range. The higher the tensile stress and the bigger its thickness are, the higher the stress layer temperature is, and the higher the compressive stress and the bigger its thickness are, the lower the stress layer temperature is. The simulation results presented in this paper could be a theoretical reference for the further study on stress measurement of conductivity material by using ECT.