High Temperature Oxidation Behavior and Conductivity of Prepared Mn-Cu spinel Coating for Metal Interconnects
摘 要
为阻止Cr的外扩散、改善金属连接体的高温性能,采用高能微弧合金化(HEMAA)工艺,选用Mn-35Cu(原子分数%)合金电极在430SS基体上制备了Cu-Mn尖晶石涂层,然后在750℃空气中原位氧化得到Cu-Mn复合尖晶石涂层。结果表明:Cu-Mn复合尖晶石涂层致密,附着力良好;涂层的主要成分除了Cu-Mn尖晶石氧化物外,还含有一定量的Mn2O3,氧化层中基体元素Cr、Fe含量较低。涂层在800℃时的面比电阻测试结果显示,氧化100 h后得到的复合Cu-Mn尖晶石涂层的电阻值为10 mΩ·cm2。高能微弧合金化原位氧化后的复合Cu-Mn尖晶石涂层是一种很有前景的金属连接体涂层。
Abstract
In order to prevent the external diffusion of Cr and improve the high temperature performance of metal joints, Cu-Mn spinel was prepared on 430SS substrate by high energy microarc alloying (HEMAA) process using Mn-35Cu (atomic fraction%) alloy electrode, and then, in situ oxidization in air at 750℃ was used to obtain a Cu-Mn composite spinel coating. The results showed that Cu-Mn composite spinel coating wass dense and had good adhesion. In addition to Cu-Mn spinel oxide, the main component of the coating also contained a certain amount of Mn2O3, and the content of Cr and Fe in the oxide layer was low. The area specific resistance test of the coating at 800℃ showed that the resistance of the composite Cu-Mn spinel coating obtained after oxidation for 100 h was 10 mΩ·cm2. The composite Cu-Mn spinel coating after in-situ oxidation of high energy micro-arc alloy was a promising metal linker coating.
中图分类号 TG174.4 DOI 10.11973/fsyfh-202001002
所属栏目 试验研究
基金项目 国家自然科学基金(51201073);江苏省研究生创新项目(KYCX17_1830)
收稿日期 2018/4/12
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引用该论文: ZHOU Tianchi,DING Jiangtao,LAI Yongbiao,SUN Hang,GUO Pingyi. High Temperature Oxidation Behavior and Conductivity of Prepared Mn-Cu spinel Coating for Metal Interconnects[J]. Corrosion & Protection, 2020, 41(1): 9
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参考文献
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