目前国内外对铜合金微细线材软化温度的测定没有出台相应的标准。通过室温拉伸试验和硬度测试使用抗拉强度和硬度测定的电子线缆用Cu-0.5Ag合金微细线的软化温度并对试验结果进行了对比分析。结果表明：使用抗拉强度和硬度测定得到的Cu-0.5Ag合金微细线的软化温度相近；使用硬度测定Cu-0.5Ag合金微细线材软化温度有很多不确定性，载荷、线径尺寸和测试位置对软化温度的测定结果均有影响。使用抗拉强度测定电子线缆用铜合金微细线材的软化温度更简便和可靠。

At present, there is no clear standard for testing the softening temperature of copper alloy microwire at home and abroad. The softening temperature of Cu-0.5Ag alloy microwire for electronic cables was tested by tensile strength and hardness by tensile strength at room temperature and hardness test, and the test results were compared and analyzed. The results show that the softening temperatures of Cu-0.5Ag alloy microwire tested by tensile strength and hardness were similar; there were many uncertainties in testing the softening temperature of microwire tested by hardness, and the load, wire diameter size and test location had influence on the test results of softening temperature. It was more convenient and reliable to use tensile strength to test the softening temperature of copper alloy microwire for electronic cables.