采用双叔丁基过氧化二异丙基苯（BIBP）作为促进剂，以丁苯树脂（SBR）增韧改性含硅芳炔树脂（PSA），研究了SBR增韧改性PSA的性能。结果表明：SBR/PSA共混体系无促进剂加入时，因两者反应活性相差较大，容易发生相分离，而BIBP的加入可以使其形成均相体系。随着SBR含量的增加，改性后的PSA弯曲强度和弯曲模量先增加后减小，当SBR含量增加到40%（质量分数）时，改性后的PSA弯曲强度和模量达到最大值。改性前PSA断面光滑，表现为脆性断裂，改性后的PSA断面纹路明显加深并增多，说明SBR有效改善了PSA的韧性。同时，随着SBR含量的增加，改性后PSA的高频介电性能不断提高。

Using bis (tert-butylperoxy isopropyl) benzene (BIPB) as accelerant, the poly(silylene-acetylen earyleneacetylene) (PSA) was toughened by styrene-butadiene resin (SBR). The properties of the PSA toughened and modified by SBR were studied. The results show that the phase separation was easy to occur when there was no accelerant in the SBR/PSA blend system because of the difference of reaction activity between the two systems, and the addition of BIPB could make it formed a homogeneous system. With the increase of SBR content, the bending strength and modulus of PSA after modification increased first and then decreased. When the content of SBR increased to 40% (mass fraction), the bending strength and modulus of PSA after modification reached the maximum value. The fracture surface of PSA before modification was smooth, showing brittle fracture. After modification, the fracture surface of PSA obviously deepen and increased, indicating that SBR effectively improved the toughness of PSA. At the same time, with the increase of SBR content, the high-frequency dielectric properties of PSA improved.