高浓度纳米二氧化硅浆料是晶圆化学机械抛光的常用磨料，保持浆料中高浓度纳米颗粒悬浮液体系的分散稳定是关键技术，通常用Zeta电位来表征，而高浓度浆料的Zeta电位测量仍存在较多问题。采用电泳光散射法，通过稀释和离心方式降低浆料浓度来测量高浓度纳米二氧化硅浆料Zeta电位，并研究了该方法的可行性。结果表明：可以保持颗粒表面和溶液间化学平衡的原液平衡稀释法是准确测量高浓度样品Zeta电位的基础；对于较难获得上层清液的高浓度浆料的稀释，离心以降低颗粒浓度的样品制备方法可快速而准确地获得Zeta电位测量结果；在同一分散体系下，Zeta电位测量值与分散体系中颗粒粒径大小无关。

High concentration nano-silica slurry is a common abrasive for wafer chemical mechanical polishing. It is key technology to keep the dispersion stability of high concentration nano particle suspension system in slurry. It is usually characterized by Zeta potential, but there are still many problems in Zeta potential measurement of high concentration slurry. The Zeta potential of high concentration nano-silica slurry was measured by electrophoretic light scattering method and the feasibility of this method was studied. The results show that the mother solution equilibrium dilution method, which can maintain the chemical equilibrium between the particle surface and the solution, is the basis for accurate measurement of Zeta potential of high concentration samples. For the dilution of high concentration slurry which is difficult to obtain the supernatant, the sample preparation method of centrifugation to reduce the particle concentration can quickly and accurately obtain the Zeta potential measurement results. In the same dispersion system, the measured Zeta potential is independent of the particle size in the dispersion system.