Thermal Deformation Behavior of 0.5% Graphene ReinforcedAluminum Composite
摘 要
在变形温度330~450℃,应变速率0.01~10 s-1条件下对0.5%(质量分数,下同)石墨烯增强铝基复合材料进行热压缩模拟试验,研究了该复合材料的热变形行为,基于流变数据建立了考虑应变补偿的本构方程,基于动态材料学模型构建了热加工图,确定了优化参数范围并选择一组优化参数进行了材料热挤压有限元模拟。结果表明:复合材料在不同热变形条件下的真应力-应变曲线均呈先上升再下降最后趋于平缓的特征,峰值应力随变形温度的升高或应变速率的减小而减小;复合材料的较优变形温度为410~430℃,应变速率为0.01~0.016 s-1,有限元模拟发现,在变形温度为420℃,应变速率为0.01 s-1条件下可以挤出质量较好的复合材料型材。
Abstract
Thermal compression simulation tests of 0.5% graphene reinforced aluminum composite were carried out under conditions of deformation temperature of 330-450 ℃ and strain rate of 0.01-10 s-1, and the thermal deformation behavior of the composite was studied. The constitutive equation considering the strain compensation was established with the flow data. The processing map was constructed by the dynamic material model, and the optimal parameter range was determined. The finite element simulation of the thermal extrusion of the material was conducted with a set of optimal parameters. The results show that the true stress-strain curves of the composite under different thermal deformation conditions showed the characteristics of first rise, then fall, and finally tending to be stable. The peak stress decreased with incresing deformation temperature and decreasing strain rate. The optimal deformation temperature of the composite was 410-430 ℃, and the strain rate was 0.01-0.016 s-1. The finite element simulation showed that the extruded composite profiles had relatively good performance at with deformation temperature of 420 ℃ and strain rate of 0.01 s-1.
中图分类号 TG131 DOI 10.11973/jxgccl202012014
所属栏目 物理模拟与数值模拟
基金项目 国家自然科学基金资助项目(51709295)
收稿日期 2019/12/23
修改稿日期 2020/11/4
网络出版日期
作者单位点击查看
备注娄淑梅(1979-),女,山东东阿人,博士
引用该论文: LOU Shumei,GUO Guangxin,LIU Yongqiang,ZHANG Pingping. Thermal Deformation Behavior of 0.5% Graphene ReinforcedAluminum Composite[J]. Materials for mechancial engineering, 2020, 44(12): 75~79
娄淑梅,郭广鑫,刘永强,张苹苹. 0.5%石墨烯增强铝基复合材料的热变形行为[J]. 机械工程材料, 2020, 44(12): 75~79
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【17】GEGEL H L. Synthesis of atomistic and continuum modeling to describe microstructure[M]. Lake Buena Uista:Computer Simulation in Materials Science,1986.
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